Product Info

Table Of Contents

Moisture Sensitivity

All plastic packages absorb moisture. During typical solder reflow operations when SMDs are

mounted onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient

temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in

vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of the

plastic mold compound, then it is possible to crack the package. Even if the package does not crack,

interfacial delamination can occur.

Since the device package is sensitive to moisture absorption, it is recommended to bake the product

before assembly.

Solder Reflow Temperature-Time Profile

Life Support Applications

Products are not designed for use in life support appliances, devices, or systems where malfunction of

these products can reasonably be expected to result in personal injury. Customers using or selling these

products for use in such applications do so at their own risk.

Additional Customization

We provide extensive customization, design and manufacturing services to ensure the perfect fit for your

product. Our wide selection of modules allows developers to create any number of products. Should you

need more information and assistance in integrating this module or developing your product, please