Datasheet

Mechanical Specifications

3 Mechanical Specifications

The Dual-Core Intel® Xeon® Processor 5200 Series is packaged in a Flip Chip Land

Grid Array (FC-LGA) package that interfaces to the baseboard via a LGA771 socket. The

package consists of a processor core mounted on a pinless substrate with 771 lands. An

integrated heat spreader (IHS) is attached to the package substrate and core and

serves as the interface for processor component thermal solutions such as a heatsink.

Figure 3-1 shows a sketch of the processor package components and how they are

assembled together. Refer to the LGA771 Socket Design Guidelines for complete details

on the LGA771 socket.

The package components shown in Figure 3-1 include the following:

• Integrated Heat Spreader (IHS)

• Thermal Interface Material (TIM)

• Processor Core (die)

• Package Substrate

• Landside capacitors

•Package Lands

Note: This drawing is not to scale and is for reference only.

3.1 Package Mechanical Drawings

The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The

drawings include dimensions necessary to design a thermal solution for the processor

including:

• Package reference and tolerance dimensions (total height, length, width, and so

forth)

• IHS parallelism and tilt

• Land dimensions

• Top-side and back-side component keepout dimensions

• Reference datums

Note: All drawing dimensions are in mm [in.].

Figure 3-1. Processor Package Assembly Sketch

IHS

Substrate

LGA771 Socket

System Board

Capacitors

Core (die)

TIM

Package Lands