Datasheet

4 Dual-Core Intel® Xeon® Processor 5200 Series Datasheet
6.2.1 Intel
®
Thermal Monitor Features...............................................................85
6.2.2 On-Demand Mode...................................................................................87
6.2.3 PROCHOT# Signal ..................................................................................88
6.2.4 FORCEPR# Signal ...................................................................................88
6.2.5 THERMTRIP# Signal................................................................................88
6.3 Platform Environment Control Interface (PECI) ......................................................89
6.3.1 Introduction...........................................................................................89
6.3.2 PECI Specifications .................................................................................90
7Features..................................................................................................................93
7.1 Power-On Configuration Options ..........................................................................93
7.2 Clock Control and Low Power States.....................................................................93
7.2.1 Normal State .........................................................................................94
7.2.2 HALT or Extended HALT State...................................................................94
7.2.3 Stop-Grant State....................................................................................96
7.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................96
7.3 Enhanced Intel SpeedStep® Technology...............................................................97
8 Boxed Processor Specifications................................................................................99
8.1 Introduction......................................................................................................99
8.2 Mechanical Specifications..................................................................................101
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)...........................................101
8.2.2 Boxed Processor Heat Sink Weight..........................................................109
8.2.3 Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)......................................................................................109
8.3 Electrical Requirements ....................................................................................109
8.3.1 Fan Power Supply (Active CEK)...............................................................109
8.3.2 Boxed Processor Cooling Requirements....................................................110
8.4 Boxed Processor Contents.................................................................................111
9 Debug Tools Specifications ....................................................................................113
9.1 Debug Port System Requirements......................................................................113
9.2 Target System Implementation..........................................................................113
9.2.1 System Implementation.........................................................................113
9.3 Logic Analyzer Interface (LAI) ...........................................................................113
9.3.1 Mechanical Considerations .....................................................................114
9.3.2 Electrical Considerations........................................................................114