Datasheet

79
Thermal Specifications
Notes:
1. The Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profile is representative of a volumetrically
constrained platform. Please refer to Table 6-4 and Table 6-5 for discrete points that constitute the thermal
profile.
2. Implementation of the Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profile should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur measurable performance
loss. (See Section 6.2 for details on TCC activation).
3. Refer to the Dual-Core Intel® Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Figure 6-2. Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profiles A and B
40
45
50
55
60
65
70
0 1020304050607080
Power [W]
Tcase [C]
Thermal Profile A (2U)
Y = 0.235*x +42.2
Thermal Profile B (1U)
Y = 0.289*x +42.9
TCASE_MAX is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
40
45
50
55
60
65
70
0 1020304050607080
Power [W]
Tcase [C]
Thermal Profile A (2U)
Y = 0.235*x +42.2
Thermal Profile B (1U)
Y = 0.289*x +42.9
TCASE_MAX is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
Table 6-4. Dual-Core Intel® Xeon® Processor X5200 Series Thermal A Profile Table
(Sheet 1 of 2)
Power (W) T
CASE_MAX
(°C)
0 42.2
5 43.4
10 44.6
15 45.7
20 46.9
25 48.1
30 49.3
35 50.4
40 51.6
45 52.3