Datasheet

Thermal Specifications
80
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in Section 2.13.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-12. The Dual-Core Intel® Xeon® Processor
L5200 Series may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
50 54.0
55 55.1
60 56.3
65 57.5
70 58.7
75 59.8
80 61.0
Table 6-5. Dual-Core Intel® Xeon® Processor X5200 Series Thermal B Profile Table
Power (W) T
CASE_MAX
(°C)
0 42.9
5 44.3
10 45.8
15 47.2
20 48.7
25 50.1
30 51.6
35 53.0
40 54.5
45 55.9
50 57.4
55 58.8
60 60.2
65 61.7
70 63.1
75 64.6
80 66.0
Table 6-6. Dual-Core Intel® Xeon® Processor L5200 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 40 5 See Figure 6-3; Table 6-7 1, 2, 3, 4, 5
Table 6-4. Dual-Core Intel® Xeon® Processor X5200 Series Thermal A Profile Table
(Sheet 2 of 2)
Power (W) T
CASE_MAX
(°C)