Datasheet

81
Thermal Specifications
Notes:
1. Dual-Core Intel® Xeon® Processor L5200 Series Thermal Profile is representative of a volumetrically
constrained platform. Please refer to Table 6-7 for discrete points that constitute the thermal profile.
2. Implementation of the Dual-Core Intel® Xeon® Processor L5200 Series Thermal Profile should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur measurable performance
loss. (See Section 6.2 for details on TCC activation).
3. Refer to the Dual-Core Intel® Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Figure 6-3. Dual-Core Intel® Xeon® Processor L5200 Series Thermal Profile
40
45
50
55
60
010203040
Power [W]
Tcase [C]
Thermal Profile
Y = 0.354*x +41.8
40
45
50
55
60
010203040
Power [W]
Tcase [C]
40
45
50
55
60
010203040
Power [W]
Tcase [C]
Thermal Profile
Y = 0.354*x +41.8
Table 6-7. Dual-Core Intel® Xeon® Processor L5200 Series Thermal Profile Table
Power (W) T
CASE_MAX
(°C)
0 41.8
5 43.6
10 45.3
15 47.1
20 48.9
25 50.7
30 52.4
35 54.2
40 56.0