Datasheet

83
Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in Section 2.13.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-12. The Dual-Core Intel® Xeon® Processor
L5215 may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile is representative of a volumetrically constrained
platform. Please refer to Table 6-11 for discrete points that constitute the thermal profile.
Table 6-9. Dual-Core Intel® Xeon® Processor L5238 Thermal Profile Table
Power (W) Nominal T
CASE_MAX
(°C) Short-term T
CASE_MAX
(°C)
04560
54964
10 52 67
15 56 71
20 60 75
25 64 79
30 67 82
35 71 86
Table 6-10. Dual-Core Intel® Xeon® Processor L5215 Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 20 5 See Figure 6-5; Table 6-11 1, 2, 3, 4, 5
Figure 6-5. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile
Thermal Profile
30
40
50
60
70
80
90
100
0 5 10 15 20
Power (W)
T
CASE
(C)
Nominal
Short Term
T
CASE
= 1.5 * P + 45
T
CASE
= 1.5 * P + 60
T
CASE
-
MAX
@
TDP
Short-term Thermal Profile may only be used for
short term excursions to higher ambient
tem
p
eratures, not to exceed 360 hours
p
er
y
ear