Datasheet

Data Sheet ADXL377
Rev. 0 | Page 11 of 12
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 16 shows the recommended soldering profile; Table 6 describes the profile features. Figure 17 shows the recommended PCB layout
or solder land drawing.
t
P
t
L
t
25°C
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
10765-016
Figure 16. Recommended Soldering Profile
Table 6. Recommended Soldering Profile
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate (T
L
to T
P
) 3°C/sec max 3°C/sec max
Preheat
Minimum Temperature (T
SMIN
) 100°C 150°C
Maximum Temperature (T
SMAX
) 150°C 200°C
Time, T
SMIN
to T
SMAX
(t
S
) 60 sec to 120 sec 60 sec to 180 sec
Ramp-Up Rate (T
SMAX
to T
L
) 3°C/sec max 3°C/sec max
Time Maintained Above Liquidous (t
L
) 60 sec to 150 sec 60 sec to 150 sec
Liquidous Temperature (T
L
) 183°C 217°C
Peak Temperature (T
P
) 240°C + 0°C/−5°C 260°C + 0°C/−5°C
Time Within 5°C of Actual Peak Temperature (t
P
) 10 sec to 30 sec 20 sec to 40 sec
Ramp-Down Rate (T
P
to T
L
) 6°C/sec max 6°C/sec max
Time 25°C to Peak Temperature (t
25°C
) 6 minutes max 8 minutes max
C
ENTER PAD IS NOT
INTERNALLY CONNECTED
BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY
0.40
MAX
0.50
0.25
1.60
0.50
0.25
3
3
0.30
MAX
1.60
DIMENSIONS SHOWN IN MILLIMETERS
10765-017
Figure 17. Recommended PCB Layout