Datasheet
ABSOLUTE MAXIMUM RATINGS
(1) (2)
DISSIPATION RATINGS
TLC5947
SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 .................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD ORDERING NUMBER TRANSPORT MEDIA, QUANTITY
TLC5947DAPR Tape and Reel, 2000
TLC5947 HTSSOP-32 PowerPAD™
TLC5947DAP Tube, 46
TLC5947RHBR Tape and Reel, 3000
TLC5947 5-mm × 5-mm QFN-32
TLC5947RHB Tape and Reel, 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Over operating free-air temperature range, unless otherwise noted.
PARAMETER TLC5947 UNIT
V
CC
Supply voltage: V
CC
– 0.3 to +6.0 V
I
O
Output current (dc) OUT0 to OUT23 38 mA
V
I
Input voltage range SIN, SCLK, XLAT, BLANK – 0.3 to V
CC
+ 0.3 V
SOUT – 0.3 to V
CC
+ 0.3 V
V
O
Output voltage range
OUT0 to OUT23 – 0.3 to +33 V
T
J(MAX)
Operating junction temperature +150 ° C
T
STG
Storage temperature range – 55 to +150 ° C
Human body model (HBM) 2 kV
ESD rating
Charged device model (CDM) 500 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
OPERATING FACTOR T
A
< +25 ° C T
A
= +70 ° C T
A
= +85 ° C
PACKAGE ABOVE T
A
= +25 ° C POWER RATING POWER RATING POWER RATING
HTSSOP-32 with
42.54 mW/ ° C 5318 mW 3403 mW 2765 mW
PowerPAD soldered
(1)
HTSSOP-32 with
22.56 mW/ ° C 2820 mW 1805 mW 1466 mW
PowerPAD not soldered
(2)
QFN-32
(3)
27.86 mW/ ° C 3482 mW 2228 mW 1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com ).
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
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