Datasheet

TLC59711
www.ti.com SBVS181A –OCTOBER 2011–REVISED JULY 2012
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
MIN MAX
Supply voltage VCC –0.3 +18 V
IREF –0.3 VREG + 0.3 V
Input voltage
SDTI, SCKI –0.3 VREG + 0.6 V
OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 –0.3 +18 V
Output voltage SDTO, SCKO –0.3 VREG + 0.3 V
VREG –0.3 +6 V
OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 75 mA
Output current (DC)
VREG –30 mA
Operating junction temperature T
J (max)
+150 °C
Storage temperature T
stg
–55 +150 °C
Human body model (HBM) 4 kV
Electrostatic discharge rating
Charged device model (CDM) 2 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
TLC59711
THERMAL METRIC
(1)
PWP UNITS
20 PINS
θ
JA
Junction-to-ambient thermal resistance 68.6
θ
JCtop
Junction-to-case (top) thermal resistance 44.2
θ
JB
Junction-to-board thermal resistance 19.3
°C/W
ψ
JT
Junction-to-top characterization parameter 2.7
ψ
JB
Junction-to-board characterization parameter 15.7
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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