Datasheet

MB85RC256V
22 DS501-00017-3v0-E
■ PACKAGE DIMENSION
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
8-pin plastic SOP Lead pitch 1.27 mm
Package width ×
package length
3.9 mm × 5.05 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 1.75 mm MAX
Weight 0.06 g
8-pin plastic SOP
(FPT-8P-M02)
(
FPT-8P-M02
)
C
1.27(.050)
3.90±0.30 6.00±0.20
.199
–.008
+.010
–0.20
+0.25
5.05
0.13(.005)
M
(.154±.012) (.236±.008)
0.10(.004)
14
58
0.44±0.08
(.017±.003)
–0.07
+0.03
0.22
.009
+.001
–.003
45 °
0.40(.016)
"A"
0~8
°
0.25(.010)
(Mounting height)
Details of "A" part
1.55±0.20
(.061±.008)
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
0.10(.004)
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1
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2
2002-2012 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-5-10
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) 1 : These dimensions include resin protrusion.
Note 2) 2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
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