Datasheet

MB85RC256V
DS501-00017-3v0-E 23
(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
8-pin plastic SOP Lead pitch 1.27 mm
Package width ×
package length
5.30 mm × 5.24 mm
Lead shape Gullwing
Lead bend
direction
Normal bend
Sealing method Plastic mold
Mounting height 2.10 mm Max
8-pin plastic SOP
(FPT-8P-M08)
(FPT-8P-M08)
C
2008-2010 FUJITSU SEMICONDUCTOR LIMITED F08016S-c-1-2
Details of "A" part
#5.30
±0.10
(.209
±.004)
INDEX
1.27(.050)
1
4
58
0.43±0.05
(.017
±.002)
"A"
(Stand off)
0~8°
(Mounting height)
2.10(.083)
MAX
0.10
+0.15
–0.05
–.002
+.006
.004
7.80
+0.45
–0.10
+.018
–.004.307
#5.24
±0.10
(.206
±.004)
BTM E-MARK
0.20
±0.05
(.008
±.002)
+0.10
–0.200.75
.030
+.004
–.008
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.