Datasheet

TSL2591 – 20 Datasheet - Apr. 2013 - ams163.5
Figure TSL2591 – 19:
FN Package – Dual Flat No-Lead Packaging Configuration
Notes:
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerence of ±75 μm.
3. Pa ck ag e to p s ur fa ce i s m ol ded with an electr ic all y n on-conduct ive clear pl as tic compound havin g a n ind ex o f r ef ra ction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NIPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Package Drawings and Markings