Datasheet

TSL2591 – 22 Datasheet - Apr. 2013 - ams163.5
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure TSL2591 – 21:
Solder Reflow Profile
Figure TSL2591 – 22:
Solder Reflow Profile Graph
Note: Not to scale – for reference only.
Parameter Reference Device
Average temperature gradient in preheating 2.5 ºC/sec
Soak time
t
soak
2 to 3 minutes
Time above 217 ºC (T1)
t
1
Max 60 sec
Time above 230 ºC (T2)
t
2
Max 50 sec
Time above T
peak
- 10 ºC (T3) t
3
Max 10 sec
Peak temperature in reflow
T
peak
260 ºC
Temperature gradient in cooling Max -5 ºC/sec
Soldering Information