Datasheet
VIA to Ground Plane
Feedback
Resistor 1
Inductor
Output
Capacitor 1
VOUT
Exposed PAD
FB
GND
PGND
VBAT
VOUT
SW
NC
PGND
PGND
LBO
SW
VOUT
EN
SYNC
LBI
LBO Resistor
GND
VIA to VBAT Plane
Input
Capacitor
GND
LBI
Resistor 1
LBI
Resistor 2
Feedback
Resistor 2
Output
Capacitor 2
TPS61030
,
TPS61031
,
TPS61032
SLUS534G –SEPTEMBER 2002–REVISED MARCH 2015
www.ti.com
12 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8 V and 5.5 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. An electrolytic or tantalum capacitor
with a value of 47 μF is a typical choice.
13 Layout
13.1 Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
13.2 Layout Example
13.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
18 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated
Product Folder Links: TPS61030 TPS61031 TPS61032