Datasheet

P
D(MAX)
+
T
J(MAX)
* T
A
R
qJA
+
125°C * 85°C
36.5°CńW
TPS61030 , TPS61031 , TPS61032
www.ti.com SLUS534G –SEPTEMBER 2002–REVISED MARCH 2015
Thermal Considerations (continued)
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum junction temperature (T
J
) of the TPS6103x devices is 125°C. The thermal resistance of the 16-pin
TSSOP PowerPAD package (PWP) is R
ΘJA
= 36.5°C/W (QFN package, RSA, 38.1°C/W), if the PowerPAD is
soldered. Specified regulator operation is assured to a maximum ambient temperature T
A
of 85°C. Therefore, the
maximum power dissipation for the PWP package is about 1096 mW, for the RSA package it is about 1050 mW.
More power can be dissipated if the maximum ambient temperature of the application is lower.
(9)
14 Device and Documentation Support
14.1 Device Support
14.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
14.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
TPS61030 Click here Click here Click here Click here Click here
TPS61031 Click here Click here Click here Click here Click here
TPS61032 Click here Click here Click here Click here Click here
14.3 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2002–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: TPS61030 TPS61031 TPS61032