Datasheet

TPS61030 , TPS61031 , TPS61032
SLUS534G –SEPTEMBER 2002–REVISED MARCH 2015 www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
I
Input voltage on LBI –0.3 3.6 V
Input voltage on SW, VOUT, LBO, VBAT, SYNC, EN, FB –0.3 7 V
T
J
Maximum junction temperature –40 150
°C
T
stg
Storage temperature range –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
MIN MAX UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000
pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22- –1000 1000
C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
MIN NOM MAX UNIT
V
I
Supply voltage at VBAT 1.8 5.5 V
T
A
Operating ambient temperature range -40 85 °C
T
J
Operating virtual junction temperature range -40 125 °C
8.4 Thermal Information
TPS6103x
THERMAL METRIC
(1)
PWP RSA UNIT
16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 46.9 35.5
R
θJC(top)
Junction-to-case (top) thermal resistance 25.8 36.7
R
θJB
Junction-to-board thermal resistance 19.4 12.9
°C/W
ψ
JT
Junction-to-top characterization parameter 0.8 0.5
ψ
JB
Junction-to-board characterization parameter 19.3 12.9
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 2.2 3.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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