Datasheet

TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059Q − NOVEMBER 2009
32
r
r
Copyright E 2009, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
PACKAGE CS Six-Lead Chipscale Device
171
1398
465
203
1250
6  100
400  50
700  55
TYP 30
500
500
375  30
500
375  30
1750
TOP VIEW
SIDE VIEW
BOTTOM VIEW
END VIEW
6   210  30
1
2
3
6
5
4
PIN OUT
BOTTOM VIEW
Lead Free
Pb
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The top of the photodiode active area is 410 μm below the top surface of the package.
D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
E. This drawing is subject to change without notice.
Figure 23. Package CS — Six-Lead Chipscale Packaging Configuration