Datasheet

TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059Q − NOVEMBER 2009
40
r
r
Copyright E 2009, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The CS, T, FN, and CL packages have been tested and have demonstrated an ability to be reflow soldered to
a PCB substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. TSL2560/61 Solder Reflow Profile
PARAMETER REFERENCE TSL2560/61
Average temperature gradient in preheating 2.5°C/sec
Soak time t
soak
2 to 3 minutes
Time above 217°C t
1
Max 60 sec
Time above 230°C t
2
Max 50 sec
Time above T
peak
−10°C t
3
Max 10 sec
Peak temperature in reflow T
peak
260° C (−0°C/+5°C)
Temperature gradient in cooling Max −5°C/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 31. TSL2560/TSL2561 Solder Reflow Profile Graph