User Manual

ADCP-75-192 • Issue 1 • December 2005 • Section 2: Description
Page 2-6
 2005, ADC Telecommunications, Inc.
Figure 2-5 Digivance CXD RF Chassis
Modules and circuit cards are placed into the RF Chassis and are mated using standard cPCI
connectors on the backplane of the chassis. Data and signals are transported over busses on the
backplane of the chassis to other modules and ports on the backside of the chassis.
Rear connections are made to the RF Chassis to connect power, route Digital IF (DIF) signals
to inputs and outputs of respective modules, connect the I2C bus to the chassis, input a 1 Hz
reference signal, input sample and reference clocks, output FAN tachometer readings to the
Digital Chassis, and distribute 12 VDC to other elements of the system. The RF Chassis also
has a Module/Port status indicator that can be used to trace signals through the system and
show activity on the ports. Figure 2-6 shows the back panel connections for the RF Chassis.
The references for the back connectors of the RF Chassis are shown in Table 2-4.