Express-BE User’s Manual Manual Revision: 1.
Revision History Revision Description Date By 1.
Preface Copyright 2015 ADLINK Technology, Inc. This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer. Disclaimer The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer.
Table of Contents Revision History ............................................................................................................ 2 Preface............................................................................................................................ 3 1. Introduction ......................................................................................................... 8 2. Specifications........................................................................................
3.3.10. USB Root Segmentation ..............................................................................................................22 3.3.11. SPI (BIOS only) .............................................................................................................................22 3.3.12. Miscellaneous..............................................................................................................................23 3.3.13. SMBus...............................................
.2. Direct Memory Access Channels ........................................................................................... 42 6.3. I/O Map.................................................................................................................................. 43 6.4. Interrupt Request (IRQ) Lines................................................................................................ 44 6.4.1. PIC Mode ...............................................................................
.6.3. 8. Boot Override..............................................................................................................................67 BIOS Checkpoints, Beep Codes ........................................................................ 68 8.1. Status Code Ranges ............................................................................................................... 69 8.2. Standard Status Codes...................................................................................
1. Introduction The Express-BE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution.
2. Specifications 2.1. ¾ Core System CPU: Dual or quad-core AMD R-Series APU (codename: Bald Eagle) • • • RX-427BB 2.7 GHz (3.6 GHz boost), 35W (4C/8CU) RX-425BB 2.5 GHz(3.4 GHz boost), 35W (4C/6CU) RX-225FB 2.2 GHz (3.0 GHz boost), 17W (2C/3CU) Supporting: AMD-V, Intel® SSE4.1 and SSE4.2, AMD Thermal Monitor (SB-TSI) Note: The availability of the features may vary between processor SKUs.
2.5. ¾ Video GPU Feature Support: Radeon HD 9000 Series supporting four independent displays and Heterogeneous System Architecture • • • • 3D graphics hardware acceleration Support for DirectX 11.1, OpenCL 1.2, OpenGL 4.2, OpenGLES 2.0 and OpenCV Video decode hardware acceleration (UVD 4.2) including support for H.264, MPEG2, VC-1, MPEG4, WMV9 and MVC formats Video encode hardware acceleration (VCE 2.0) including support for H.
2.10. Power Specifications ¾ Power Modes: AT and ATX mode (AT mode startup controlled by SEMA) ¾ Standard Voltage Input: ATX @ 12V±5%,/ 5Vsb ±5% or AT @ 12V ±5% ¾ Wide Voltage Input: ATX @ 8.5-20V, 5Vsb ±5% or AT @ 8.5-20V ¾ Power Management: ACPI 4.0 compliant, Smart Battery support ¾ Power States: supports C0, C1, C1E, C6, CC6, S0, S3, S5, S5 ECO mode (Wake-on-USB S3, WOL S3/S5) ¾ ECO mode: supports deep S5 for 5Vsb power saving 2.11. Power Consumption TBD 2.12.
Page 12 CD AB UMI 2.16.
2.17. Mechanical Dimensions Top View Side View All Ø tolerances ± 0.05 mm Other tolerances ± 0.
3. Pinouts and Signal Descriptions 3.1. AB/CD Pin Definitions The Express-BE is a Type 6 module supporting USB 3.0 and DDI channels on the CD connector. In the table below, all standard pins of the COM Express specification are described, including those not supported on the Express-BE.
Row A Row B Row C Pin Name Pin Name Pin Name A36 USB6- B36 USB7- C36 A37 USB6+ B37 USB7+ C37 A38 USB_6_7_OC# B38 USB_4_5_OC# A39 USB4- B39 USB5- A40 Row D Pin Name DDI3_CTRLCLK_AUX+ D36 DDI1_PAIR3+ DDI3_CTRLDATA_AUX- D37 DDI1_PAIR3- C38 DDI3_DDC_AUX_SEL D38 RSVD C39 DDI3_PAIR0+ D39 DDI2_PAIR0+ USB4+ B40 USB5+ C40 DDI3_PAIR0- D40 DDI2_PAIR0- A41 GND (fixed) B41 GND (fixed) C41 GND (fixed) D41 GND (fixed) A42 USB2- B42 USB3- C42 DDI3_PAIR1+ D42
Row A Row B Row C Row D Pin Name Pin Name Pin Name Pin Name A80 GND (fixed) B80 GND (fixed) C80 GND (fixed) D80 GND (fixed) A81 LVDS_A_CK+ B81 LVDS_B_CK+ C81 PEG_RX9+ D81 PEG_TX9+ A82 LVDS_A_CK- B82 LVDS_B_CK- C82 PEG_RX9- D82 PEG_TX9- A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRL C83 TPM_PP D83 RSVD A84 LVDS_I2C_DAT B84 VCC_5V_SBY C84 GND D84 GND A85 GPI3 B85 VCC_5V_SBY C85 PEG_RX10+ D85 PEG_TX10+ A86 RSVD B86 VCC_5V_SBY C86 PEG_RX10- D86 PEG_TX10- A
3.2. Signal Description Terminology The following terms are used in the COM Express AB/CD Signal Descriptions below. I Input to the Module O Output from the Module I/O Bi-directional input/output signal OD Open drain output I 3.3V Input 3.3V tolerant I 5V Input 5V tolerant O 3.3V Output 3.3V signal level O 5V Output 5V signal level I/O 3.3V Bi-directional signal 3.3V tolerant I/O 5V Bi-directional signal 5V tolerant I/O 3.3Vsb Input 3.
3.3. AB Signal Descriptions 3.3.1. Audio Signals Signal Pin # Description I/O AC_RST# / HDA_RST# A30 Reset output to CODEC, active low. O 3.3VSB AC_SYNC / HDA_SYNC A29 Sample-synchronization signal to the CODEC(s). O 3.3V AC_BITCLK / HDA_BITCLK A32 Serial data clock generated by the external CODEC(s). I/O 3.3V AC _SDOUT / HDA_SDOUT A33 Serial TDM data output to the CODEC. O 3.3V AC _SDIN[2:0] HDA_SDIN[2:0] B28 B30 Serial TDM data inputs from up to 3 CODECs. I/O 3.3VSB 3.3.2.
Signal Pin # Description I/O LVDS_B0+ LVDS_B0LVDS_B1+ LVDS_B1LVDS_B2+ LVDS_B2LVDS_B3+ LVDS_B3- B71 B72 B73 B74 B75 B76 B77 B78 LVDS Channel B differential pairs O LVDS LVDS_B_CK+ LVDS_B_CK- B81 B82 LVDS Channel B differential clock O LVDS LVDS_VDD_EN A77 LVDS panel power enable O 3.3V LVDS_BKLT_EN B79 LVDS panel backlight enable O 3.3V LVDS_BKLT_CTRL B83 LVDS panel backlight brightness control O 3.3V LVDS_I2C_CK A83 DDC lines used for flat panel detection and control. O 3.
Signal Pin # Description I/O SATA1_TX+ SATA1_TX- B16 B17 Serial ATA channel 1, Transmit Output differential pair. O SATA AC coupled on Module SATA1_RX+ SATA1_RX- B19 B20 Serial ATA channel 1, Receive Input differential pair. I SATA AC coupled on Module SATA2_TX+ SATA2_TX- A22 A23 Serial ATA channel 2, Transmit Output differential pair. O SATA AC coupled on Module SATA2_RX+ SATA2_RX- A25 A26 Serial ATA channel 2, Receive Input differential pair.
3.3.7. Express Card Signal Pin # Description I/O PU/PD EXCD0_CPPE# EXCD1_CPPE# A49 B48 PCI ExpressCard: PCI Express capable card request I 3.3V PU 10k 3.3V EXCD0_PERST# EXCD1_PERST# A48 B47 PCI ExpressCard: reset O 3.3V 3.3.8. LPC Bus Signal Pin # Description I/O LPC_AD[0:3] B4-B7 LPC multiplexed address, command and data bus I/O 3.3V LPC_FRAME# B3 LPC frame indicates the start of an LPC cycle O 3.3V LPC_DRQ0# LPC_DRQ1# B8 B9 LPC serial DMA request I 3.
Signal Pin # Description I/O PU/PD Comment I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier drain driver from a USB current monitor on the carrier board may drive this line low. USB_6_7_OC# A38 USB over-current sense, USB ports 6 and 7. A pull-up for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low. 3.3.10.
3.3.12. Miscellaneous Signal Pin # Description I/O PU/PD SPKR B32 Output for audio enunciator, the “speaker” in PC-AT systems O 3.3V WDT B27 Output indicating that a watchdog time-out event has occurred. O 3.3V THRM# B35 Input from off-module temp sensor indicating an over-temp situation. I 3.3V THRMTRIP# A35 Active low output indicating that the CPU has entered thermal shutdown. O 3.3V FAN_PWMOUT B101 Fan speed control.
Signal Pin # Description I/O PU/PD GPI[1] A63 General purpose input pins. Pulled high internally on the module. I 3.3V PU 10K 3.3V GPI[2] A67 General purpose input pins. Pulled high internally on the module. I 3.3V PU 10K 3.3V GPI[3] A85 General purpose input pins. Pulled high internally on the module. I 3.3V PU 10K 3.3V PU/PD Comment 3.3.16.
Signal Pin # Description I/O PU/PD Comment LID# A103 LID button. Low active signal used by the ACPI operating system for a LID switch. I OD 3.3VSB PU 10k 3.3VSB Emulated on GPIO (BIOS) SLEEP# B103 Sleep button. Low active signal used by the ACPI operating system to bring the system to sleep state or to wake it up again. I OD 3.3VSB PU 10K 3.3VSB Emulated on GPIO (BIOS) Comment 3.3.18.
3.4. CD Signal Descriptions 3.4.1. USB 3.
3.4.3.
DDI 2 Signal Pin Description DDI2_PAIR0+ DDI2_PAIR0DDI2_PAIR1+ DDI2_PAIR1DDI2_PAIR2+ DDI2_PAIR2DDI2_PAIR3+ DDI2_PAIR3- D39 D40 D42 D43 D46 D47 D49 D50 Digital Display Interface2 differential pairs DDI2_HPD D44 DDI2_CTRLCLK_AUX+ C32 DDI2_CTRLCLK_AUX- DDI2_DDC_AUX_SEL C33 I/O PU/PD Comment PD 100K IF DDI2_DDC_AUX_SEL is floating I/O PCIe DP2_AUX+ IF DDI2_DDC_AUX_SEL pulled high I/O OD 3.
3.4.4.
3.4.5.
Signal PEG_LANE_RV# 3.4.6. Pin D54 Description PCI Express Graphics lane reversal input strap. Pull low on the Carrier board to reverse lane order. I/O I 3.3V PU/PD Module Type Definition Signal Pin # Description TYPE0# TYPE1# TYPE2# C54 C57 D57 The TYPE pins indicate to the Carrier Board the Pin-out Type that is implemented on the module. The pins are tied on the module to either ground (GND) or are noconnects (NC). For Pinout Type 1, these pins are don’t care (X).
4. Module Interfaces and Configuration This chapter describes connectors and pinouts, LEDs and switches that are used on the module but are not included in the standard PICMG specification. 4.1. Connector, Switch and LED Locations BIOS Defaults Reset Switch CD AB Fan 4-pin Fan 4.1.1.
4.2. 40-pin Multipurpose Connector ¾ FPC Connector type: FCI 59GF Flex 10042867 ¾ Pin Orientation: 1 40 Pin Definitions (on COMe module) ¾ Pin Interface Signal Remark Pin Interface Signal 1 SPI Program interface VCC_SPI_IN SPI Power Input from flash tool to module.
4.3. Status LEDs To facilitate easier maintenance, status LED’s are mounted on the board. LED1 LED2 LED3 ¾ LED Descriptions: Name Color Connection Function LED1 Blue BMC output Power Sequence Status Code (BMC) Power Changes, RESET (see 5.1.
4.4.
4.5. BIOS Setup Defaults Reset Button To perform a hardware reset of BIOS default settings, perform the following steps: 1. Shut down the system. 2. Press the BIOS Setup Defaults Reset Button continuously and boot up the system. You can release the button when the BIOS prompt screen appears 3. The BIOS prompt screen will display a confirmation that BIOS defaults have been reset and request that you reboot the system.
4.6. Express-BE Switch Settings 4.6.1. Switch Locations 4.6.2. SW1: BIOS Select and Mode Configuration Switch The module has two BIOS chips and BIOS operation can be configured to "PICMG" and dual-BIOS "Failsafe" modes using SW1, Pin 2. Setting the module to PICMG mode will configure the BIOS chips on the module as SPI0 and SPI1. In PICMG mode, a BIOS chip cannot be placed in the SPI0 slot on the carrier. In dual-BIOS Failsafe mode, both BIOS chips on the module are configured as SPI1.
4.7. PCIe x16-to-two-x8 Adapter Card The Express-BE can be used with the PCIe x16-to-two-x8 Adapter Card on the Express-BASE6 Reference Carrier to support bifurbication of the CPU's PEG interface (PCIe x16). The card reroutes the PCIe x16 to two x8 and allows testing of two independent PCIe add-on cards with x8/x4/x2/x1 width. To use the card, set BIOS > Advanced > Graphics > GFX LINK CFG to "2 x8 " as described in 7.3.3 .Graphics on page 53. PCIex16-to-two-x8 Adapter Card (Model: P16TO28, Part No.
5. Smart Embedded Management Agent (SEMA) The onboard microcontroller (BMC) implements power sequencing and Smart Embedded Management Agent (SEMA) functionality. The microcontroller communicates via the System Management Bus with the CPU/chipset. The following functions are implemented ¾ Total operating hours counter counts the number of hours the module has been run in minutes. ¾ On-time minutes counter counts the seconds since last system start.
5.1. Board Specific SEMA Functions 5.1.1. Voltages The BMC of the Express-BE implements a voltage monitor and samples several onboard voltages. The voltages can be read by calling the SEMA function “Get Voltages”. The function returns a 16-bit value divided into high-byte (MSB) and low-byte (LSB). 5.1.2. ADC Channel Voltage Name Voltage Formula [V] 0 Not used 1 +V3.3V (MSB<<8 + LSB) x 1.1 x 3.3 / 1024 2 +V1.05S (MSB<<8 + LSB) x 3.3 / 1024 3 +V3.3V (MSB<<8 + LSB) x 1.1 x 3.
5.1.4. Exception Codes In case of an error, the BMC drives a blinking code on the blue Status LED (LED1). The same error code is also reported by the BMC Flags register. The Exception Code is not stored in the Flash Storage and is cleared when the power is removed. Therefore, a “Clear Exception Code” command is not needed or supported. Exception Code Error Message 0 NOERROR 2 NO_SUSCLK 3 NO_SLP_S5 4 NO_SLP_S4 5 NO_SLP_S3 6 BIOS_FAIL 7 RESET_FAIL 8 POWER_FAIL 9 LOW_VIN 10 11 V3.
6. System Resources 6.1.
6.3.
6.4. Interrupt Request (IRQ) Lines 6.4.1.
6.4.2.
6.5.
6.6.
7. BIOS Setup 7.1. Menu Structure This section presents the six primary menus of the BIOS Setup Utility. Use the following table as a quick reference for the contents of the BIOS Setup Utility. The subsections in this section describe the submenus and setting options for each menu item. The default setting options are presented in bold, and the function of each setting is described in the right hand column of the respective table.
7.2. Main The Main Menu provides read-only information about your system and also allows you to set the System Date and Time. Refer to the tables below for details of the submenus and settings. 7.2.1. System Information Feature Options Description BIOS Version Info only ADLINK BIOS version Build Date and Time Info only Date the BIOS was built 7.2.2. Memory Information Feature Options Description Total Memory Info only Display total memory information 7.2.3. System Management 7.2.3.1.
Feature 7.2.3.3. Description CPU Fan Speed Read only Display CPU fan speed System Fan Speed Read only Display system fan speed System Management > Power Consumption Feature Options Power Consumption Info only 7.2.3.4. Page 50 Options Description Current Input Current Read only Display input current Current Input Power Read only Display input power V3.30 Read only Display actual V3.30 voltage V1.05 Read only Display actual V1.05 voltage V3.30 Read only Display actual V3.
7.2.3.5. System Management > Flags Feature Options Flags Info only BMC Flags 7.2.3.6. Description Read only BIOS Select Read only Display the selection of current BIOS ROM ATX/AT-Mode Read only Display ATX/AT-Mode Exception Code Read only System exception reason System Management > Power Up Feature Options Power Up Info only Power Up watchdog Attention: F12 disables the Power Up Watchdog.
Feature Options Description CPU fan the specified PWM level PWM Level 40 CPU Trigger Point 3 Read only Trigger Temperature 70 Specifies the temperature threshold at which the BMC turns on CPU fan the specified PWM level PWM Level 63 Select PWM level CPU Trigger Point 4 7.2.4.
Feature Options Description SVM Mode Enabled Disabled Enable/disable CPU Virtualization C6 Mode Enabled Disabled Enable/disable C6 Node Configuration Submenu 7.3.1.1. Node Configuration Feature Options Node Configuration Info only 7.3.2. Description Memory Feature Options Description Total Memory Info only Display Total Memory. Memory Clock Submenu Socket 0 Information Submenu 7.3.2.1.
Feature Options Description PSPP Policy Disabled Performance Balanced-High Balanced-Low Power Saving PCIe Speed Power Policy PEG Gen Auto Gen 1 Gen 2 Control PEG Gen GFX LINK CFG x16 2 x8 PCIe x16 configuration.
Feature Options Description SATA Power on Port1 Enabled Disabled SATA port Power support Enable/disable SATA PORT- MODE GEN1 GEN2 SATA HotPlug Port1 Enabled Disabled SATA Port2 Info only eSATA PORT on Port2 Enabled Disabled SATA port 2 support eSATA Enable/disable SATA Power on Port2 Enabled Disabled SATA port Power support Enable/disable SATA PORT- MODE GEN1 GEN2 SATA HotPlug Port2 Enabled Disabled SATA Port3 Info only eSATA PORT on Port3 Enabled Disabled SATA port 3 support eSATA
Feature Options Description USB transfer time-out 1 sec 5 sec 10 sec 20 sec The time-out value for control, bulk, and interrupt transfers Device reset time-out 10 sec 20 sec 30 sec 40 sec USB mass storage device Start Unit command time-out. Device power-up delay Auto Manual Maximum time the device will take before it properly reports itself to the Host Controller. 'Auto' uses default value: for a Root port it is 100 ms, for a Hub port the delay is taken from Hub descriptor.
7.3.6. Network Feature Options Network Info only Network Stack Enabled Disabled Enable/Disable UEFI network stack. UEFI PXE Driver Enabled Disabled Enable/Disable UEFI PXE Driver LAN device enable/disable Enabled Disabled LAN device enable/disable 7.3.7.
Feature Options Description Maximum Read Request Auto 128 Bytes 256 Bytes 512 Bytes 1024 Bytes 2048 Bytes 4096 Bytes Set maximum read request size of PCI Express device or allow system BIOS to select the value.
Feature Options Description IDO Completion Enable Enabled Disabled If supported by hardware and set to "Enabled", this permits setting the number of ID-Based Ordering (IDO) bit (Attribute[2]) requests to be initiated. LTR Mechanism Enable Enabled Disabled If supported by hardware and set to "Enabled", this enables the Latency Tolerance Reporting (LTR) Mechanism.
Feature Options Description Disabled Hotplug Basic Hotplug Server Hotplug Enhanced Hotplug Inboard NB Root Port Hotplug Mode Control Enabled Disabled Dev3 Fun2 Enabled/Disabled ASPM Mode Control Disabled L0s Entry L1 Entry L0s And L1 Entry NB Root Port ASPM Mode Control Hotplug Mode Control Disabled Hotplug Basic Hotplug Server Hotplug Enhanced Hotplug Inboard NB Root Port Hotplug Mode Control Enabled Disabled Dev3 Fun3 Enabled/Disabled ASPM Mode Control Disabled L0s Entry L1 Entry L0s And L
Feature Options GPP Gen2 Enabled Disabled UMI Gen2 Enabled Disabled GPP HW Compliance Mode Disabled Port A Port B Port C Port D SB GPP LANE REVERSAL Enabled Disabled UMI PHY PLL Power Down Enabled Disabled SB GPP PHY PLL Power Down Enabled Disabled Hide unused GPP ports Enabled Disabled SB GPP Port A Enabled Disabled SB GPP Port B Enabled Disabled SB GPP Port C Enabled Disabled SB GPP Port D Enabled Disabled PCIE Posted Pass Non-posted Hudson-1 Hudson-2 UMI ASPM L1 Timer Auto Overr
7.3.8. Super IO Feature Options Super IO Chip Info only W83627DHG Super IO Configuration Submenu NCT5104D Super IO Configuration Submenu Serial Port 1 Configuration Serial Port Enabled Disabled Enable/Disable Serial Port 1 (COM0). Device Settings IO=3F8h; IRQ=4 Fixed configuration of serial port.
7.3.10. Sound Feature Options Sound Info only HD Audio Azalia Device Disabled Enabled Auto HD Onboard PIN Config Enabled Disabled Azalia Front Panel Auto Disabled Enabled SDIN0 Pin Config Azalia GPIO SDIN1 Pin Config Azalia GPIO SDIN2 Pin Config Azalia GPIO SDIN3 Pin Config Azalia GPIO Azalia Snoop Enabled Disabled Description 7.3.11.
Feature Console Redirection Settings 7.3.11.1. Options Description Submenu The settings specify how the host computer and the remote computer (which the user is using) will exchange data. Both computers should have the same or compatible settings. Serial Port Console > Console Redirection Settings Feature Options COM0/COM1/COM2/COM3 Console Redirection Settings Info only Terminal Type VT100 VT100+ VT-UTF8 ANSI VT100: ASCII char set. VT100+: Extends VT100 to support color, function keys, etc.
7.3.12. Thermal Feature Options Description Thermal Info only Critical Trip Point Disabled 85 C 95 C This value controls the temperature of the ACPI Critical Trip Point the point at which the OS will shut the system down. Active Cooling Trip Point Disabled 40 C 50 C 60 C 70 C BMC Default Active Cooling Trip Point. Passive Trip Point Disabled 90 C 80 C This value controls the temperature of the ACPI Passive Trip Point the point at which the OS will begin throtting the processor. 7.3.13.
Feature Options Hard Drive BBS Priorities Info only CSM16 Parameters Submenu CSM Parameters Submenu 7.4.2. Boot Configuration > CSM16 Parameters Feature Options CSM16 Module Version Info only GateA20 Active Upon Request Always Option ROM Messages Force BIOS Keep Current INT19 Trap Response Immediate Postponed 7.4.3. Description Description UPON REQUEST - GA20 can be disabled using BIOS services.
7.5. Security 7.5.1. Password Description Feature Options Administrator Password Enter password User Password Enter password Description 7.6. Save & Exit 7.6.1. Save and Exit > Reset Options Feature Options Description Save Changes and Reset Save changes and reset the system. Save Changes and Reset Discard Changes and Reset Reset the system without saving any changes. Discard Changes and Reset 7.6.2.
8. BIOS Checkpoints, Beep Codes This section of this document lists checkpoints and beep codes generated by AMI Aptio BIOS. The checkpoints defined in this document are inherent to the AMIBIOS generic core, and do not include any chipset or board specific checkpoint definitions. Checkpoints and Beep Codes Definition A checkpoint is either a byte or word value output to I/O port 80h.
8.1. Status Code Ranges Status Code Range Description 0x01 – 0x0F SEC Status Codes & Errors 0x10 – 0x2F PEI execution up to and including memory detection 0x30 – 0x4F PEI execution after memory detection 0x50 – 0x5F PEI errors 0x60 – 0xCF DXE execution up to BDS 0xD0 – 0xDF DXE errors 0xE0 – 0xE8 S3 Resume (PEI) 0xE9 – 0xEF S3 Resume errors (PEI) 0xF0 – 0xF8 Recovery (PEI) 0xF9 – 0xFF Recovery errors (PEI) 8.2. Standard Status Codes 8.2.1.
8.2.2. SEC Beep Codes None 8.2.3.
Status Code Description 0x3C Post-Memory South Bridge initialization (South Bridge module specific) 0x3D Post-Memory South Bridge initialization (South Bridge module specific) 0x3E Post-Memory South Bridge initialization (South Bridge module specific) 0x3F-0x4E OEM post memory initialization codes 0x4F DXE IPL is started PEI Error Codes 0x50 Memory initialization error. Invalid memory type or incompatible memory speed 0x51 Memory initialization error.
Status Code Description 0xF2 Recovery process started 0xF3 Recovery firmware image is found 0xF4 Recovery firmware image is loaded 0xF5-0xF7 Reserved for future AMI progress codes Recovery Error Codes 0xF8 Recovery PPI is not available 0xF9 Recovery capsule is not found 0xFA Invalid recovery capsule 0xFB – 0xFF Reserved for future AMI error codes 8.2.4.
Status Code Description 0x6C North Bridge DXE initialization (North Bridge module specific) 0x6D North Bridge DXE initialization (North Bridge module specific) 0x6E North Bridge DXE initialization (North Bridge module specific) 0x6F North Bridge DXE initialization (North Bridge module specific) 0x70 South Bridge DXE initialization is started 0x71 South Bridge DXE SMM initialization is started 0x72 South Bridge devices initialization 0x73 South Bridge DXE Initialization (South Bridge module
Status Code Description 0xA6 SCSI Detect 0xA7 SCSI Enable 0xA8 Setup Verifying Password 0xA9 Start of Setup 0xAA Reserved for ASL (see ASL Status Codes section below) 0xAB Setup Input Wait 0xAC Reserved for ASL (see ASL Status Codes section below) 0xAD Ready To Boot event 0xAE Legacy Boot event 0xAF Exit Boot Services event 0xB0 Runtime Set Virtual Address MAP Begin 0xB1 Runtime Set Virtual Address MAP End 0xB2 Legacy Option ROM Initialization 0xB3 System Reset 0xB4 USB hot pl
8.2.6. DXE Beep Codes # of Beeps Description 4 Some of the Architectural Protocols are not available 5 No Console Output Devices are found 5 No Console Input Devices are found 1 Invalid password 6 Flash update is failed 7 Reset protocol is not available 8 Platform PCI resource requirements cannot be met 8.2.7.
9. Mechanical Information 9.1. Board-to-Board Connectors To allow for different stacking heights, the receptacles for COM Express carrier boards are available in two heights: 5 mm and 8 mm. When 5 mm receptacles are chosen, the carrier board should be free of components. Tyco 3-1827253-6 Foxconn QT002206-2131-3H • 220-pin board-to-board connector with 0.5mm for a stacking height of 5 mm. • This connector can be used with 5 mm through-hole standoffs (SMT type).
9.2. Thermal Solution 9.2.1. Heat Spreaders The function of the heat spreader is to ensure an identical mechanical profile for all COM Express modules. By using a heat spreader, the thermal solution that is built on top of the module is compatible with all COM Express modules. 9.2.2. Heat Sinks A heat sink can be used as a thermal solution for a specific COM Express module and can have a fan or be fanless, depending on the thermal requirements. 9.2.3.
Step 3: Assemble the heatsink onto the COM Express module. Use the four M2.5, L=6mm screws provided to fasten the heatsink to the module. Step 4: Place the COM Express module and heatsink assembly onto the connectors on the carrier board as shown. Then press down on the module until it is firmly seated on the carrier board. Step 5: Use the five M2.5, L=16mm screws provided to secure the COM Express module to the carrier board from the solder side.
Step 6: If you are installing a heatsink with a fan, plug the fan connector into the carrier board as shown.
9.3. Mounting Methods There are several standard ways to mount the COM Express module with a thermal solution onto a carrier board. In addition to the choice of 5 mm or 8mm board-to-board connectors, there is the choice of Top and Bottom mounting. In Top mounting, the threaded standoffs are on the carrier board and the thermal solution is equipped with through-hole standoffs. In Bottom mounting, the threaded standoffs are on the thermal solution and the carrier board has through-hole standoffs.
9.4. Standoff Types The standoffs available for Top and Bottom mounting methods are shown below. Note that threaded standoffs are DIP type and throughhole standoffs are SMT type. Other types not listed are available upon request.
Safety Instructions Read and follow all instructions marked on the product and in the documentation before you operate your system. Retain all safety and operating instructions for future use. • Please read these safety instructions carefully. • Please keep this User‘s Manual for later reference. • The equipment should be operated only from the type of power source indicated on the rating label. Make sure the voltage of the power source when connect the equipment to the power outlet.
Getting Service ADLINK Technology, Inc. Address: Tel: Fax: Email: 9F, No.166 Jian Yi Road, Zhonghe District New Taipei City 235, Taiwan +886-2-8226-5877 +886-2-8226-5717 service@adlinktech.com Ampro ADLINK Technology, Inc. Address: Tel: Toll Free: Fax: Email: 5215 Hellyer Avenue, #110, San Jose, CA 95138, USA +1-408-360-0200 +1-800-966-5200 (USA only) +1-408-360-0222 info@adlinktech.com ADLINK Technology (China) Co., Ltd. Address: Tel: Fax: Email: 300 Fang Chun Rd.
ADLINK Technology, Inc. (French Liaison Office) Address: 6 allée de Londres, Immeuble Ceylan 91940 Les Ulis, France Tel: +33 (0) 1 60 12 35 66 Fax: +33 (0) 1 60 12 35 66 Email: france@adlinktech.com ADLINK Technology Japan Corporation Address: KANDA374 Bldg. 4F, 3-7-4 Kanda Kajicho, Chiyoda-ku Tokyo 101-0045, Japan Tel: +81-3-4455-3722 Fax: +81-3-5209-6013 Email: japan@adlinktech.com ADLINK Technology, Inc.
