Datasheet

AENEON™ Data Sheet 3 Revision 1.10, 2008-05
A Qimonda AG Brand Doc. # 01282008-5Q5R-K6FR
DDR2 Register
Memory Module
Attention:Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
TABLE 4
Absolute Maximum Ratings
TABLE 5
Environmental Requirements
For more information, please contact your AENEON representative
Symbol Parameter Rating Unit Note
Min. Max.
V
DD
Voltage on V
DD
pin relative to V
SS
–1.0 +2.3 V
1)
1) When V
DD
and V
DDQ
and V
DDL
are less than 500 mV; V
REF
may be equal to or less than 300 mV.
V
DDQ
Voltage on V
DDQ
pin relative to V
SS
–0.5 +2.3 V
V
DDL
Voltage on V
DDL
pin relative to V
SS
–0.5 +2.3 V
V
IN
, V
OUT
Voltage on any pin relative to V
SS
–0.5 +2.3 V
Parameter Symbol Values Unit Note
Min. Max.
Operating temperature (ambient) T
OPR
––°C
1)
1) The application designer must meet the case temperature specifications for individual module components.
Operating temperature (ambient) T
OPR
0+55°C
2)
2) The component maximum case temperature (Tcase) shall not exceed the value specified in the DDR2 DRAM component
specification.
Operating temperature (ambient) T
OPR
0+65°C
Storage Temperature T
STG
– 50 +100 °C
3)
3) Storage Temperature is the case surface temperature on the center/top side of the DRAM.
Barometric Pressure (operating & storage) PBar +69 +105 kPa
4)
4) Up to 3000 m.
Operating Humidity (relative) H
OPR
10 90 %
Storage Humidity (without condensation) H
STG
595%