Technical data
18
Measurement Tips, Calibration, Traceability, and Measurement Uncertainties
5.1 Measurement Tips
There are four important steps that 
are necessary to achieve better power 
measurement results:
•  Understanding the modulation 
formats of the signal under test,
•  Understanding the power sensor 
technology and operating 
 principles,
•  Understanding the principles of 
power measurement traceability, 
and
•  Selecting the right sensor and PC, 
power meter or display for the 
signals under test.
These principles are discussed in 
detail in Application Note 64–4D, 
“4 Steps for Making Better Power 
Measurements.” 
2 
To achive optimum 
results in measuring power with 
the new USB power sensors, it is 
recommended for users to read the 
referenced note. Of course, since the 
USB sensors feature CW and average 
power measurements, we will briefl y 
review the above four steps with 
regards to the specifi c performance of 
their diode-stack sensor confi guration.
Getting to know the performance 
capabilities of the diode sensors is 
important in order to understand how 
they process test signal formats. For
example, do signal crest factors 
or peak power spikes cause the 
diode sensor to deviate from the 
dynamic range square-law detection? 
High crest factors can occur in 
modern wireless signal formats. 
Do the averaging processes inside 
the digitizing sensor depend on a 
synchronization between the digital-
sampling periods and the digital data 
clocks of the wireless signal? 
The U2000 Series sensors are based 
on the LBS technology, pioneered by 
Hewlett-Packard in 1975. Throughout 
the last three decades, dramatically 
improved products have been 
introduced. For example, the U2000 
Series is partially based on the diode 
confi gurations used in the popular 
Agilent E9300-Series wide-dynamic 
range average-power sensors. An 
extensive technical description of the 
E9300-Series diode technology is given 
in AN 1449–2. [Ref: 1.2, page 24 — 29] 
To achieve the expanded dynamic 
ranges (–60 to +20 dBm), diode stacks 
are incorporated in place of single 
diodes, to extend the square-law 
conversion range to higher power 
levels (+20 dBm in this case) at the 
expense of a little sensitivity (see 
Figure 23). For example, a series 
connection of (m) diodes results in a 
low-level sensitivity degradation of 10 
log (m) dB. But, (m) diodes provide 
an extension upwards in power limits 
of the square-law detection region 
maximum power of 20 log (m) dB. 
This yields a net improvement in 
square-law dynamic range of 10 log 
(m) dB, compared to a single diode 
confi guration.
The U2000 Series sensors are 
implemented as a modifi ed barrier 
integrated diode (MBID) on one chip
3
, 
with a 1-diode balanced pair for the 
low power path (–60 dBm to –10 
dBm), a 30 dB-resistive divider 
attenuator and a 2-diode stack pair for 
the high power path (–10 dBm to +20 
dBm), as shown in Figure 6. 
The U2000 Series sensors’ 
architecture is based on a data-
compensation algorithm that is 
calibrated and stored in an individual 
SDRAM resident in each sensor. The 
data algorithm stores the information 
of three parameters, input power level 
vs. frequency vs. temperature for the 
range of 9 kHz to 24 GHz and –60 
dBm to +20 dBm and 0°C to 55°C, 
depending on the model number. 
Naturally, since the U2000 Series 
is self-contained and requires a 
substantial internal circuitry to achieve 
digital conversion and measurement 
communication on the USB bus, the 
SDRAM and Flashdrive memory 
technologies exhibit a non-volatile-
type data storage.
Figure 23 The RF/microwave diode stacks are super-integrated onto a single
   MBID which combines channel switching and the on-board power 
   zeroing function.
RF Input
High-Power Path
(–10 to +20 dBm)
Low-Power Path
(–60 to –10 dBm)
2  Refer to Agilent 4 Steps for Making Better Power Measurements, Literature Number 5965-8167EN
3  Refer to Zurakowski, M, et al, Nov, 1986, Diode Integrated Circuits for MM Applications, Hewlett-Packard Journal.










