Water Pump User Manual

206

Introduction to the Quaternary Pump

Instrument Layout

The industrial design of the module incorporates several innovative features.

It uses Agilent’s E-PAC concept for the packaging of electronics and

mechanical assemblies. This concept is based upon the use of expanded

polypropylene (EPP) layers foam plastic spacers in which the mechanical

and electronic boards components of the module are placed. This pack is

then housed in a metal inner cabinet which is enclosed by a plastic external

cabinet. The advantages of this packaging technology are:

• virtual elimination of fixing screws, bolts or ties, reducing the number of

components and increasing the speed of assembly/disassembly,

• the plastic layers have air channels molded into them so that cooling air

can be guided exactly to the required locations,

• the plastic layers help cushion the electronic and mechanical parts from

physical shock, and

• the metal inner cabinet shields the internal electronics from

electromagnetic interference and also helps to reduce or eliminate radio

frequency emissions from the instrument itself.