LTE Module Series EC25 Hardware Design EC25-AF Hardware Design Short version PART OF EC25 LTE Module Series Rev. EC25-AF _Hardware_Design_V1.
LTE Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2020-08-21 T.Vahtera Initial version stripped and edited from Quectel version 1.5 1.1 2020-09-07 T.Vahtera Added FCC and IC notifications 1.2 2020-09-08 T.
LTE Module Series EC25 Hardware Design 1 Introduction This document defines the EC25 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. Associated with application note and user guide, customers can use EC25 module to design and set up mobile applications easily.
LTE Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25-AF is part of EC25 series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication modules which has receive diversity possibility. EC25-AF provides data connectivity on LTE-FDD and WCDMA networks. It also provides optional support for GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS) and voice functionality (in Telematics version) for customers’ specific application.
LTE Module Series EC25 Hardware Design 2.2. Key Features The following table describes the detailed features of module. Table 2: Key Features of EC25 Module Feature Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands LTE Features Support up to non-CA Cat 4 FDD and TDD Support 1.
LTE Module Series USB Interface EC25 Hardware Design Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB* Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.
LTE Module Series EC25 Hardware Design NOTES 1. 1) 2. 2) Within Within operation temperature range, the module is 3GPP compliant. extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances.
LTE Module Series EC25 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EC25 and illustrates the major functional parts. ⚫ ⚫ ⚫ ⚫ ⚫ Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces Figure 1: Functional Diagram NOTE “*” means under development.
LTE Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform.
LTE Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. 2 4 6 141 142 8 9 10 11 13 14 15 16 17 18 Figure 2: Pin Assignment (Top View) NOTES 1. 1) means 2. 3. 2) PWRKEY 4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads 118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT function is under development.
LTE Module Series EC25 Hardware Design 6. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the BT module. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keep out area. 9. “*” means under development. 3.3.
LTE Module Series EC25 Hardware Design 3.4. Power Supply 3.4.1. Power Supply Pins EC25 provides four VBAT pins to connect with the external power supply, and there are two separate voltage domains for VBAT. ⚫ ⚫ Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description VBAT_RF 57, 58 VBAT_BB GND Min. Typ. Max. Unit Power supply for module’s RF 3.
LTE Module Series EC25 Hardware Design is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2mm.
LTE Module Series EC25 Hardware Design NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shutdown by PWRKEY or AT command, then the power supply can be cut off. 3.5. Turn on and off Scenarios 3.5.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No.
LTE Module Series EC25 Hardware Design The turn on scenario is illustrated in the following figure. NOTE VBAT PWRKEY ≥500 ms VIH≥1.3V VIL≤0.5V RESET _N ≥ 2 .5 s STATUS (OD ) ≥12 s UART Inactive Active ≥13 s USB Inactive Active Figure 12: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them should be no no less than 30ms. 3.5.2.
LTE Module Series EC25 Hardware Design VBAT ≥650ms ≥29.5s PWRKEY STATUS (OD) Module Status RUNNING Power-down procedure OFF Figure 13: Timing of Turning off Module 3.5.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. NOTES 1.
LTE Module Series EC25 Hardware Design Table 8: RESET_N Pin Description Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8V power domain The reset scenario is illustrated inthe following figure. VBAT ≤460ms ≥150ms VIH≥1.3V RESET_N VIL≤0.5V Module Status Running Resetting Restart Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2.
LTE Module Series EC25 Hardware Design 3.7. (U)SIM Interface The(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of the (U)SIM Interface Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically.
LTE Module Series EC25 Hardware Design If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
LTE Module Series EC25 Hardware Design 3.8. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface.
LTE Module Series EC25 Hardware Design A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
LTE Module Series EC25 Hardware Design Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module’s input and output circuit designs, but please pay attention to the direction of connection.
LTE Module Series EC25 Hardware Design 3.10. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ⚫ ⚫ Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB.
LTE Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 27 IO PCM data bit clock 1.
LTE Module Series EC25 Hardware Design MICBIAS PCM _CLK BCLK PCM _SYNC LRCK PCM _OUT DAC PCM _IN ADC I2C_SCL SCL I2C_SDA SDA INP INN S A BI LOUTP K 7. 4 Module K 7. 4 LOUTN Codec 1 .8 V Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R=22 Ω, C= 22pF) circuit s on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.11. SD Card Interface EC25 supports SDIO 3.
LTE Module Series SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 EC25 Hardware Design 29 30 31 IO IO IO SD card SDIO bus DATA2 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SD card SDIO bus DATA1 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open.
LTE Module Series EC25 Hardware Design Figure 25: Reference Circuit of SD card In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided.
LTE Module Series EC25 Hardware Design 3.12. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 16: Pin Definition of ADC Interfaces Pin Name Pin No.
LTE Module Series EC25 Hardware Design 3.13. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 18: Pin Definition of Network Connection Status/Activity Indicator Pin Name NET_MODE NET_STATUS Pin No. 5 6 I/O Description DO Indicate the module registration mode.
LTE Module Series EC25 Hardware Design 3.14. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 20: Pin Definition of STATUS Pin Name STATUS Pin No.
LTE Module Series EC25 Hardware Design The following table shows the pin definition of SGMII interface. Table 22: Pin Definition of the SGMII Interface Pin Name Pin No. I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.
LTE Module Series EC25 Hardware Design The following figure shows a reference design of SGMII interface with PHY AR8033 application. Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design: ⚫ ⚫ ⚫ ⚫ Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc.
LTE Module Series EC25 Hardware Design 3.15. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. The following table shows the pin definition of wireless connectivity interfaces. Table 23: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.
LTE Module Series EC25 Hardware Design BT_RTS* 37 DI BT UART request to send 1.8V power domain BT_TXD* 38 DO BT UART transmit data 1.8V power domain BT_RXD* 39 DI BT UART receive data 1.8V power domain BT_CTS* 40 DO BT UART clear to send 1.8V power domain. Cannot be pulled up before startup. PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.8V power domain PCM_SYNC1) 26 IO PCM data frame synchronization signal 1.
LTE Module Series EC25 Hardware Design NOTES 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to output signals. 3. For more information about wireless connectivity interfaces, please refer to document [5]. 4. 5. “*” means under development. 1) Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BT module. 3.16. USB_BOOT Interface EC25 provides a USB_BOOT pin.
LTE Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
LTE Module Series Accuracy (GNSS) EC25 Hardware Design CEP-50 Autonomous @open sky <1.5 m NOTES 1. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3.
LTE Module Series EC25 Hardware Design Table 26: Pin Definition of RF Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN 49 IO Main antenna pad 50Ω impedance Receive diversity antenna pad 50Ω impedance If unused, keep it open. ANT_DIV 35 AI 5.1.2.
LTE Module Series EC25 Hardware Design LTE FDD B7 2500~2570 2620~2690 MHz LTE FDD B8 880~915 925~960 MHz LTE FDD B12 699~716 729~746 MHz LTE FDD B13 777~787 746~756 MHZ LTE FDD B14 788~798 758~768 MHZ LTE FDD B18 815~830 860~875 MHz LTE FDD B19 830~845 875~890 MHz LTE FDD B20 832~862 791~821 MHz LTE FDD B28 703~748 758~803 MHz LTE TDD B38 2570~2620 2570~2620 MHz LTE TDD B40 2300~2400 2300~2400 MHz LTE TDD B41 2555~2655 2555~2655 MHz LTE TDD B66 1710~1780 2
LTE Module Series EC25 Hardware Design Main Antenna Module R1 0R ANT_MAIN C1 C2 NM NM Diversity Antenna R2 0R ANT_DIV C3 C4 NM NM Figure 32: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default. Place the π-type matching components (R1 &C1&C2, R2 &C3&C4) as close to the antenna as possible. 5.1.4.
LTE Module Series EC25 Hardware Design Figure 33: Microstrip Line Design on a 2-layer PCB Figure 34: Coplanar Waveguide Line Design on a 2-layer PCB Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) 42 / 62
LTE Module Series EC25 Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and they should be fully connected to ground.
LTE Module Series EC25 Hardware Design VDD 0.1uF 10R Module GNSS Antenna 47nH 100pF 0R ANT_GNSS NM NM Figure 37: Reference Circuit of GNSS Antenna NOTES 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
LTE Module Series EC25 Hardware Design Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1561MHz~1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
LTE Module Series 6 EC25 Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
LTE Module Series Parameter Description VBAT_BB and VBAT_RF VBAT EC25 Hardware Design Conditions The actual input voltages must stay between the minimum and maximum values. Min. Typ. Max. Unit 3.3 3.8 4.3 V 400 mV 1.8 2.0 A 5.0 5.25 V Voltage drop during Maximum power control burst transmission level on EGSM900. IVBAT Peak supply current (during transmission slot) USB_VBUS USB detection Maximum power control level on EGSM900. 3.0 6.3.
LTE Module Series EC25 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Parameter Description OFF state Conditions Typ. Unit Power down 10 uA 1.0 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=128 (USB disconnected) 1.4 mA LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA WCDMA PF=64 (USB disconnected) 23.3 mA WCDMA PF=64 (USB connected) 33.4 mA LTE-FDD PF=64 (USB disconnected) 17.
LTE Module Series EC25 Hardware Design LTE-FDD B5 @23.0dBm 600.0 mA LTE-FDD B12 @23.08dBm 692.0 mA LTE-FDD B13 @23.1dBm 660.0 mA LTE-FDD B14 @23.5dBm 676.0 mA LTE-FDD B66 @22.9dBm 662.0 mA LTE-FDD B71 @22.88dBm 600.0 mA WCDMA B2 @23.24dBm 570.0 mA WCDMA voice WCDMA B4 @23.2dBm call 581.0 mA WCDMA B5 @23.4dBm 500.0 mA Table 41: GNSS Current Consumption of EC25 Series Module Parameter Description Searching (AT+CFUN=0) IVBAT (GNSS) Tracking (AT+CFUN=0) Conditions Typ.
LTE Module Series EC25 Hardware Design 6.5. RF Output Power The following table shows the RF output power of EC25 module. Table 42: RF Output Power Frequency Max. Min. WCDMA bands 24dBm+1/-3dB <-49dBm LTE-FDD bands 23dBm±2dB <-39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6.
LTE Module Series EC25 Hardware Design LTE-FDD B13 (10M) -98.1dBm -98.4dBm -100.2dBm -93.3dBm LTE-FDD B14 (10M) -97.9dBm -98.6dBm -99.5dBm -93.3dBm LTE-FDD B66 (10M) -96.7dBm -98.1dBm -99.4dBm -96.5dBm LTE-FDD B71 (10M) -99.2dBm -99.4dBm -101.5dBm -94.2dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7.
LTE Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1.
LTE Module Series EC25 Hardware Design Figure 44: Module Bottom Dimensions (Bottom View) 53 / 62
7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in thehost PCB.
7.3.
NOTE These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel. 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2.
8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.20mm. It is suggested that the peak reflow temperature is 235ºC~245ºC (for SnAg3.0Cu0.5 alloy).
8.3. Packaging EC25 is packaged in tap and reel carriers. One reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm.
19 Terms and Abbreviations Table 53: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex 59 / 6
FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long
PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TX T
Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Vol
10 Regulatory FCC Certification Requirements According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and portable applications.
For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).
IC Statement IRSS-GEN "This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1.
