Technical Specs
Table Of Contents
- Important Notice
- Safety and Hazards
- Limitation of Liability
- Patents
- Copyright
- Trademarks
- Contact Information
- Revision History
- 1: Introduction
- 2: Electrical Specifications
- 3: RF Specifications
- 4: Power
- 5: Software Interface
- 6: Mechanical and Environmental Specifications
- 7: Regulatory Compliance and Industry Certifications
- A: Antenna Specification
- B: Design Checklist
- C: Packaging
- D: References
- E: Acronyms
- Index
Product Technical Specification
Rev 3 Oct.20 54 41113694
Figure 6-2: Copper Pad Location on Bottom Side of Module
To enhance heat dissipation:
• It is recommended to add a heat sink that mounts the module to the main PCB or
metal chassis (a thermal compound or pads must be used between the module and
the heat sink).
• Maximize airflow over/around the module.
• Locate the module away from other hot components.
• Module mounting holes must be used to attach (ground) the device to the main PCB
ground or a metal chassis.
• You may also need active cooling to pull heat away from the module.
Note: Adequate dissipation of heat is necessary to ensure that the module functions properly.
Module Integration Testing
When testing your integration design:
• Test to your worst case operating environment conditions (temperature and voltage)
• Test using worst case operation (transmitter on 100% duty cycle, maximum power)
• Monitor temperature at all shield locations. Attach thermocouples to the areas
indicated in Figure 6-1 on page 53 (RF, Baseband).
Note: Make sure that your system design provides sufficient cooling for the module.
(For acceptance, certification, quality, and production (including RF) test suggestions, see
Testing on page 67.)
Baseband
RF