User's Manual

ManualsBrandsALE International ManualsElectronicsBluetooth module

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Table of Content

GENERALITIES ............................................................................................................... 2

1.1

NTRODUCTION

............................................................................................................................................. 2

1.1.1

Overview .................................................................................................................................................. 2

1.1.2

Aim of the document ................................................................................................................................. 3

1.2

ERVICES PROVIDED BY THE FEATURE OR EQUIPMENT

................................................................................. 3

1.3

XTERNAL

NTERFACES

................................................................................................................................ 3

1.4

ERMINOLOGY

BBREVIATIONS

................................................................................................................. 5

1.5

ELATED

OCUMENTS

................................................................................................................................. 6

GENERAL REQUIREMENTS ........................................................................................ 7

2.1

EATURES

..................................................................................................................................................... 7

2.2

TANDARDS

.................................................................................................................................................. 7

2.2.1

BT related certification ............................................................................................................................ 7

2.3

NVIRONMENTAL REQUIREMENTS

................................................................................................................ 8

GENERAL DESCRIPTION ............................................................................................. 9

3.1

FUNCTION GLOBAL LOGICAL BLOC DIAGRAM

......................................................................................... 9

3.2

DAUGHTER BOARD BLOC DIAGRAM

......................................................................................................... 9

3.3

ECHANICAL ASPECTS AND INTEGRATION

................................................................................................. 10

3.4

PECIFICATION

............................................................................................................................................ 11

DETAILED TECHNICAL DESCRIPTION .................................................................. 12

4.1

LECTRONIC

............................................................................................................................................... 12

4.1.1

BT chip solution to be implemented ....................................................................................................... 12

4.1.2

Schematic ............................................................................................................................................... 13

4.2

ADIOFREQUENCY

...................................................................................................................................... 14

4.2.1

Antenna choice ....................................................................................................................................... 14

4.2.2

Immunity to external spurious and interferences ................................................................................... 15

4.2.3

Quality of supply .................................................................................................................................... 15

4.3

AYOUT

...................................................................................................................................................... 16

4.3.1

BTDB layout ........................................................................................................................................... 16

4.3.2

Place requirements of BTDB on mainboard .......................................................................................... 16

4.4

OFTWARE

.................................................................................................................................................. 16

4.5

ERTIFICATION

........................................................................................................................................... 17

4.5.1

General aspects on the “module” concept ............................................................................................ 17

THERMAL MANAGEMENT ........................................................................................ 18

RELIABILITY ................................................................................................................ 18

INDUSTRIAL CONSIDERATIONS .............................................................................. 18

7.1

ANUFACTURING

....................................................................................................................................... 18

7.2

EQUIREMENTS

.......................................................................................................................................... 18

7.3

ESTABILITY

............................................................................................................................................... 18

7.3.1

Testpoints................................................................................................................................................ 18

7.3.2

Test strategy ........................................................................................................................................... 19

7.3.3

Test method ............................................................................................................................................. 20

7.4

ECHANICAL ASSEMBLY

NDUSTRIAL FEASIBILITY

.................................................................................. 23

7.4.1

Board outline .......................................................................................................................................... 23

7.4.2

Board technology ................................................................................................................................... 23

7.4.3

Connections ............................................................................................................................................ 24

7.4.4

Mounting on the main board .................................................................................................................. 24

7.4.5

Shielding Mounting ................................................................................................................................ 26

Summary of content (26 pages)

PAGE 1
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. Table of Content 1. GENERALITIES ............................................................................................................... 2 1.1 INTRODUCTION ............................................................................................................................................. 2 1.1.1 Overview .............................
PAGE 3
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. This device complies with Industry Canada’s licence-exempt RSSs.
PAGE 4
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. Pin N° Name 1 GND 2 3 4 5 6 7 VDD_IO GND SLOW_CLK GND HCI_RX TX_DBG 8 HCI_CTS 9 10 GND GND 11 HCI_RTS 12 13 14 15 16 17 HCI_TX GND PCM_SYNC PCM_CLK PCM_OUT PCM_IN 18-23 GND Function Keep feet on the ground. Direct path supply for 1.8V I/O pads. Keep feet on the ground. 32.768KHz +/- 250ppm Keep feet on the ground.
PAGE 5
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. Check the CC2564C datasheet for more information. This cabling supposes that the Host is in DTE mode. In case of DCE host, RTS and CTS are straight, and not crossed.
PAGE 7
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 2. General Requirements 2.1 Features The board must provide the following features: • Give dual mode BT connectivity (Classic & Low Energy), so BT4.1 • Integrate the antenna, done with copper tracks on the PCB • Interface to the motherboard with UART and PCM, USB not required. • Permit a very low cost solution.
PAGE 8
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 2.3 Environmental requirements These are the same as for the terminal for which this board is intended. The tests are made on the daughter board mounted in a final product, so they are part of the product qualification. This BTDB board cannot be co-located with other transmitters.
PAGE 9
3.1 BT function global logical bloc diagram 3.2 BT daughter board bloc diagram 1.8V 2.2V-4.8V 1.8V VDD Vdd I/O LDO_out DC/DC UART UART PCM PCM/I2S 32.768KHz SlowClock GPIO Enable Bandpass filter Crystal 26MHz TI CC2564C < 20ppm Daughter Board PCB 2.4GHz Antenna All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 3.
PAGE 10
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. The CC2564C communicates with a standard HCI through the UART interface. Here is a representation of the lower part of the stack, which is inside the CC2564C: This means that the upper part of the stack must be hosted in the mother board cpu. 3.
PAGE 11
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 3.4 Specification Parameter Value Standard support Bluetooth 2.1 + EDR, BLE 4.2 Host interface HCI UART VBAT 1.7 Volts, 4.8 Volts VDD_IO Min, Max 1.62 Volts, 1.
PAGE 12
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 4. Detailed Technical Description 4.1 Electronic 4.1.1 BT chip solution to be implemented The chosen chip to implement BT4.2 compliant connectivity is the Texas Instruments CC2564C chip. This is a dual mode (Classic + Low Energy) one chip solution.
PAGE 14
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 4.2 Radiofrequency 4.2.1 Antenna choice Two major types of antennas could be implemented: • Ceramic antenna: very compact, these are easy to mount, but have a cost of around 13 cents. Their performance is medium. • PCB antenna: this uses a track of copper on the PCB. It gives good performance at 2.
PAGE 15
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 4.2.2 Immunity to external spurious and interferences The BT radio can be perturbed by external high amplitude radiofrequency fields. In this case, the BT may show high bit error rate for example. To improve the immunity of the BTDB, we will foresee a soldered shield, for risk mitigation.
PAGE 16
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. An 1.8V feed is provided for the I/O. This is not a sensitive supply and no special care is needed for this in terms of noise (the typical noise level found on digital boards on 1.8V is acceptable). 4.3 Layout 4.3.1 BTDB layout The layout recommendations from Texas Instruments must be followed. Refer to document: http://www.ti.
PAGE 17
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 4.5 Certification 4.5.1 General aspects on the “module” concept This gives some clarifications about the “module” definition given by FCC. Single-modular transmitter has to comply with all eight following requirements: i. The radio elements must have the radio frequency circuitry shielded.
PAGE 18
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 5. Thermal management No thermal issue is foreseen for this board, as power levels are low (about 130mW in EDR full throughput). So no special thermal care must be taken. 6. Reliability It can be calculated with CADRE tool according to the reliability database user guide. http://alda.web.alcatel-lucent.
PAGE 19
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. This is used during certification where conducted tests are done. The RF test point will be at top side, with the center point on the RF wire.
PAGE 20
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. In consequence, the generated RF signal at the tester must be increased to compensate this. The best reliable solution is to take a golden sample of the board to setup the RF level for conducted BER measurement. This will simplify the procedure in manufacturing.
PAGE 21
Here is a table that gives examples of tests for each feature: All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. Function Power and power-up Nbr of connections VDD_IN VDD_IO Slow_CLK Fast_CLK SP download Enable must be LOW. Start VDD_IN, HCI_RTS goes then VDD_IO. Apply Slow Clock. from HIGH to Apply Fast Clock. Make a transition LOW. LOW to HIGH on Enable.
PAGE 22
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. Function Nbr of connections Power regulators DIG_LDO_OUT MLDO_OUT SRAM_LDO_OUT ADCPPA_LDO_OUT CL1.5_LDO_OUT DCO_LDO_OUT Power IN VDD_IO CL1.5_LDO_IN MLDO_IN BT RF BT RF BT RF IN RF ANT Method Test OK if The 6 testpoints will be available on the bottom side of the board. Test the value, and the ripple (in AC).
PAGE 23
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 7.4 Mechanical assembly / Industrial feasibility 7.4.1 Board outline The board must be as small as possible. Nevertheless, this depends on the antenna type implemented, and to routing optimizations that could be done. This size may be changed if smaller. Provision is also made for a soldered shield, in case of high interferers. See chapter 7.4.
PAGE 24
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. 7.4.3 Connections To reduce cost, we want to avoid a board to board connector. The daughter board will use the technique of the cut metal holes on the board edge (top view): Metal holes Gold plating PCB Before milling During milling Resulting connections The connections number is 27, spread over three sides of the board as following: 7.4.
PAGE 25
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. o • Also signal vias shall be prohibited to avoid risks of short-circuit with main board GND.
PAGE 26
All rights reserved. Passing on and copying of this document, use and communication of its contents not permitted without written authorization from Alcatel. On Main board, the recommended footprint is as follows: The GND pins must be connected to the GND plane as short as possible, with enough vias. Dotted line is the board outline. 7.4.5 Shielding Mounting The target is to deliver a BTDB without shielding. All modules on the market have a shielding.