User's Manual

use and communication of its contents

not permitted

without written authorization from Alcatel.

5. Thermal management

No thermal issue is foreseen for this board, as power levels are low (about 130mW in EDR full

throughput). So no special thermal care must be taken.

6. Reliability

It can be calculated with CADRE tool according to the reliability database user guide.

http://alda.web.alcatel-lucent.com/transition_docs/CADRE_SR332/SR332-CADRE-main.html

Usually the calculation is done within the final product (the phone)

7. Industrial Considerations

7.1 Manufacturing

Trimming

The radio has an auto-calibration feature. This means that once the radio parameters have been

defined by engineering, and stored in the chip, there is

no need of trimming in manufacturing.

During engineering, care must be taken to define the right RF level output taking into account the

losses in the bandpass filter and potential impedance adaptation cells.

7.2 Requirements

The module is considered as a component for the manufacturing, and must be stores in a reel, in

vacuum packing until is mounted on the mother board.

Refer to doc: [3] and [4] for more information

7.3 Testability

This proposal is based on a discussion with NPI. This may be refined in a second step.

7.3.1 Testpoints

There is no need of having one test-point per trace, as the board will not use ICT.

The AOI (automatic vision) test is foreseen to be made before the shield is put on the board, but

before the soldering.

For the RF track to antenna, there will be a pad in series, in order to disconnect the PCB antenna by

cutting the track. The pad will then be used to get the RF signal, and the GND surrounding for the

shield. See other IP-Phones CPUs for reference.