User's Manual

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This is used during certification where conducted tests are done.
The RF test point will be at top side, with the center point on the RF wire. This is TP 8
Note: After the tuning, matching circuits are reduced from PI filter(2 capacitors and 1 resistor) to single
0402 size inductor L100 3nH.
7.3.2 Test strategy
The board is simple enough to be tested in functional, without ICT.
The other point is that the shield may be mounted, so we have no access to the possible test points
under it. On the other PCB side, there must be no test point, as this side is in direct contact with the
CPU board.
7.3.2.1 Test of the daughter board alone
So the test on the daughter board will be done by functional checks:
• Each interface is activated (see chapter 7.3.3)
• The RF is checked through a tester antenna (through the air or on the RF testpoint)
• Some test points will be available on the bottom side for the integrated power regulators.
These tests will validate the solders of components on the daughter board
As usual, two tests are done:
• Radiated test (with tester antenna) for the RF power which covers emission
• Conducted test (the signal is taken on TP8) for BER, which covers reception
Remark : the conducted test means that the RF tester is in parallel of the printed antenna, which
cannot be disconnected without unsoldering a component (which can’t be done in production).
We look for GO/NOGO test and not radio setting. A basic calculation shows that the Voltage
Standing Wave Ration (VSWR) will be around 2, which gives a maximum of 9.5dB reflected RF
power in worst case.
To Antenna
L100
Antenna
Matching
RF Test
point
TP 8
Cut here for BT
certification in
conduction
Ground
plane
Gold
plating