User's Manual

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In consequence, the generated RF signal at the tester must be increased to compensate this. The
best reliable solution is to take a golden sample of the board to setup the RF level for conducted
BER measurement. This will simplify the procedure in manufacturing.
Radiated test: RF power (High level signal)
Conducted test: BER (low level signal)
7.3.2.2 Test of the daughter board mounted in a phone
For the tests of the BTDB on the mother board, we must consider it as a component.
• The connections to the BTDB are checked by functional test of the interfaces
• The RF is tested through the air.
Only the RF radiated test is done to check:
• RF power level
• BT connection (for example by pairing a device)
7.3.3 Test method
Here is an overview of the means to test the connections within the BTDB.
The board can be individually tested (no need of mounting it on the CPU).
Many functions of the chip can be driven through UART Vendor Specific commands.
The list is given in the following document:
http://processors.wiki.ti.com/index.php/CC256x_VS_HCI_Commands (also available in doc ref [3]).
Some test method can also be taken from the following page:
http://processors.wiki.ti.com/index.php/CC256x_Testing_Guide (also available in doc ref [3]).
Before any RF is activated, the Service Pack (SP) must be downloaded to the CC2564C. For
manufacturing, this ServicePack will be stored in PDM.
It may evolve with time, but the manufacturing tools do not need to have the latest version, because
the phone software will have it integrated, and download it at phone start-up.
Only if there is an identified but which could impact the manufacturing tests, the SP will be updated.
Both antenna
and tester are
connected:
mismatch with
about 9.5dB
reflected
power max.