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Advanced Micro Devices

Thermal Design Guide for

Socket F (1207) Processors

32800Publication # 3.00Revision:

August 2006Issue Date:

Summary of content (62 pages)

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Thermal Design Guide for Socket F (1207) Processors Publication # 32800 Issue Date: August 2006 Revision: 3.
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© 2005 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.
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2800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 1.1 Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors List of Figures Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 3.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . .
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors List of Tables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors. . . . . . . . . . . .13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 3.
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Thermal Design Guide for Socket F (1207) Processors 8 List of Tables 32800 Rev. 3.
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32800 Rev. 3.00 Thermal Design Guide for Socket F (1207) Processors August 2006 Revision History Date Revision July 2006 3.00 Description Initial Public release.
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Thermal Design Guide for Socket F (1207) Processors 10 Revision History 32800 Rev. 3.
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32800 Rev. 3.00 August 2006 Chapter 1 Thermal Design Guide for Socket F (1207) Processors Introduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings, descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the requirements for the socket F (1207) processors. 1.
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Thermal Design Guide for Socket F (1207) Processors 12 Introduction 32800 Rev. 3.
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32800 Rev. 3.00 Thermal Design Guide for Socket F (1207) Processors August 2006 Chapter 2 Processor Thermal Solutions This chapter describes the thermal solutions for systems based on socket F (1207) processors. 2.1 Processor Specifications The objective of thermal solutions is to maintain the processor temperature within specified limits. Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be considered during the design of a thermal solution.
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Thermal Design Guide for Socket F (1207) Processors 2.2 32800 Rev. 3.02 August 2006 Socket Description Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207) processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x 35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the center, plus a 0.66 mm offset between the two BGA arrays.
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32800 Rev. 3.00 August 2006 Chapter 3 Thermal Design Guide for Socket F (1207) Processors Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution This chapter describes the motherboard component height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-Ina-Box (PIB) thermal solution for socket F (1207) processors. 3.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with better thermal performance. Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB thermal solution for socket F (1207). 3.
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32800 Rev. 3.00 Thermal Design Guide for Socket F (1207) Processors August 2006 Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors. Table 3.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly The backplate is mounted on the backside of the motherboard and enhances local stiffness to support shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive motherboard warpage in the area near the processor.
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the backplate. The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM standoffs serve as attachment points for the retention frame screws. They also align the backplate properly to the motherboard.
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Thermal Design Guide for Socket F (1207) Processors 20 32800 Thermal Design of Platforms Using the AMD Processor-In-aBox (PIB) Thermal Solution Rev. 3.
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32800 Rev. 3.02 3.00 August 2006 Chapter 4 Thermal Design Guide for Socket F (1207) Processors Thermal Design of Custom 1U-2P Systems This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 1U-2P systems based on socket F (1207) processors. Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and acoustic performance in these systems.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 4 on page 21. This space permits heat sink designs with better thermal performance. Appendix B on page 45 shows a complete, detailed set of keep-out drawings for custom 1U-2P systems based on socket F (1207) processors. 4.
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32800 Rev. 3.02 3.00 Table 5.
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Thermal Design Guide for Socket F (1207) Processors Figure 5. 32800 Rev. 3.02 August 2006 Exploded View of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5. 4.3.1 Backplate Assembly For details on the backplate assembly, see section 3.3.1 on page 18. Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches. 4.3.
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32800 Rev. 3.02 3.00 Thermal Design Guide for Socket F (1207) Processors August 2006 Lifting the heat sink away from the processor can result in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life of the processor and the socket and for repeated installations and upgrades of the processor. 4.3.3 Heat Sink Figure 6 shows a picture of the reference design heat sink for 1U-2P systems.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Other fan and heat sink combinations may yield adequate thermal performance. The system designer must ensure that the thermal solution provides required cooling for the processor for the given system layout and flow characteristics. Because the processor-mounting surface extends above the surface of the cam box on the socket, the heat sink bottom can be flat.
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32800 Rev. 3.02 3.00 4.3.5 August 2006 Thermal Design Guide for Socket F (1207) Processors Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink. AMD recommends using a high performance grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend using phase change materials between the heat sink and the processor.
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Thermal Design Guide for Socket F (1207) Processors 28 Thermal Design of Custom 1U-2P Systems 32800 Rev. 3.
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32800 Rev. 3.02 August 2006 Chapter 5 Thermal Design Guide for Socket F (1207) Processors Thermal Design of Custom 2U-4P Systems This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 2U-4P systems based on socket F (1207) processors. Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and acoustic performance in these systems.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 8 on page 29. This space permits heat sink designs with better thermal performance. Appendix C on page 53 shows a complete, detailed set of keep-out drawings for custom 2U-4P systems based on socket F (1207) processors. 5.
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32800 Rev. 3.02 Table 8.
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Thermal Design Guide for Socket F (1207) Processors Figure 9. 32800 Rev. 3.00 August 2006 Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors The following sections describe the mechanical requirements of the components shown in Figure 9. 5.3.1 Backplate Assembly For details on the backplate assembly, see section 3.3.1 on page 18. Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.
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32800 Rev. 3.02 5.3.2 Thermal Design Guide for Socket F (1207) Processors August 2006 Spring Clip The spring clip is designed to apply 75 lbs of force to the center of the heat sink. This force is necessary to help prevent the heat sink from lifting off of the package during shock or vibrationinduced events. Lifting the heat sink away from the processor can result in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints.
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin efficiency. This design provides optimum heat spreading performance from the processor to the heat sink. The fin geometry has been designed to provide optimized thermal performance in combination with the fans, as described in Section 5.3.
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32800 Rev. 3.02 Thermal Design Guide for Socket F (1207) Processors August 2006 on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is approximately 18 CFM. Figure 11 shows that this flow rate corresponds to a case-to-ambient thermal resistance of 0.22°C/W. This case-to-ambient thermal resistance exceeds requirements (see Table 7 on page 30). Figure 11. 5.3.
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Thermal Design Guide for Socket F (1207) Processors 36 Thermal Design of Custom 2U-4P Systems 32800 Rev. 3.
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32800 Rev. 3.00 August 2006 Appendix A Thermal Design Guide for Socket F (1207) Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors.
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Figure 12. 38 A B C D 7 8 .7 4 7 0 .0 0 8 6 2 .0 0 8 4 3 .0 0 4 3 .0 0 2 8 .0 0 1 9 .5 4 8 .0 0 1 3 .9 0 7 7 1 9 .9 1 1 1 3 .0 0 1 0 4 .0 8 8 8 .9 0 7 9 .8 0 6 0 .0 0 P in A 1 6 P in A 1 5 .9 0 8 .8 0 3 .6 0 6 .0 0 1 0 .0 0 R 2 .9 7 1 0 .0 0 R 2 .9 7 1 /1 8 /2 0 0 6 C h a n g e d d r a w i n g t i t le . 2 .1 I n it ia l R e le a s e 2 .0 DATE 1 1 /0 8 /2 0 0 5 D E S C R IP T IO N REV. 3 8 . 0 0 [ 0 . 3 1 5 '' ] M a x c o m p o n e n t h e i g h t . 3 . 3 0 [ 0 .
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A B 0.966 24.54 1.441 36.59 8 7 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t . 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d . R 6 .9 5 0 .2 7 4 2 x 2x 0.787 19.99 C 7 2x 0.39 7 10.09 D 8 6 6 C P in A 1 5 A 5 B 2.534 64.36 M o u n tin g H o le s , C o n t a c t P a d s , a n d N o R o u tin g Z o n e V ie w 0.000 0.00 2x 1.
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A B C D Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors 8 7 6 P in A 1 5 5 4 4 1 1 .6 3 0 .4 5 8 0 .0 0 0 .0 0 0 1 8 .3 7 0 .7 2 3 5 3 .3 3 2 .1 0 0 5 0 .3 3 1 .9 8 1 6 1 .8 7 2 .4 3 6 3 3 2 2 DWG. NO. 79Z0000124 1 REV 2 .
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A B C D 7 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors 8 7 8 . 0 0 [ 0 . 3 1 5 ' '] M a x c o m p o n e n t h e i g h t . 3 . 3 0 [ 0 . 1 3 0 ' '] M a x c o m p o n e n t h e i g h t . H e a t S in k H e ig h t R e s t r ic t io n Z o n e 8 1.44 1 2x 1.26 5 2x 1.08 6 2x Appendix A 36.59 32.13 27.59 Figure 15. 6 6 P in A 1 5 5 2x 8 .6 0 0 .3 3 9 4 1 3 .4 0 0 .5 2 8 2 1 .0 0 0 .8 2 7 2x 2x 2x 2 8 .1 4 1 .1 0 8 0 .0 0 0 .
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A B 7 6 5 5 1 2 .6 3 0 .4 9 7 0 .0 0 0 .0 0 0 4 9 .3 7 1 .9 4 4 4 4 3 3 2 2 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors DWG. NO. 79Z0000124 1 REV 2 .
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A B 6 0.00 1.318 33.47 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors 8 7 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t . 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t ; N o o u t e r l a y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d . 1 0 .0 0 0 .3 9 4 2 x N o n - p la t e d th r u h o le 0.39 7 2x 10.09 8 .8 0 0 .3 4 6 4x 6 0.000 2x 0.233 5.
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Thermal Design Guide for Socket F (1207) Processors 44 32800 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Rev. 3.
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32800 Rev. 3.00 August 2006 Appendix B Thermal Design Guide for Socket F (1207) Processors Keep-Out Drawings for Custom 1U2P Systems Based on the Socket F (1207) Processor Appendix B contains detailed recommended keep-out drawings for processor heat sink and mounting hardware for a custom 1U-2P system based on the socket F (1207) processors. Depending on the system features and layout, more space around the processor may be available for the thermal solution than is shown in these drawings.
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Figure 18. 46 A B C D 5 6 .0 0 8 6 6 .0 0 7 8 .7 4 8 2 8 .0 0 4 3 .0 0 8 .0 0 8 .0 0 1 3 .9 0 7 7 1 2 5 .2 4 8 8 .9 0 6 0 .0 0 1 3 .0 0 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor 6 S id e 5 5 8 .8 0 5 .9 0 7 .6 2 4 4 D E S C R IP T IO N C h a n g e d 1 U 2 S n o ta tio n to 1 U /2 P D im e n s io n c h a n g e s d u e t o o r ig io n s h if t o f - 0 . 8 6 m m in x a n d - 0 .
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A B C D Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor 8 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t . 7 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t ; T i e t o g r o u n d . 0 .0 0 0 .0 0 0 3 .1 3 0 .1 2 3 2 x 9 .6 3 0 .3 7 9 2 x 1 1 .4 2 0 .4 5 0 2 x 1 8 .3 7 0 .7 2 3 2 x 2 5 .3 2 0 .9 9 7 2 x 3 9 .8 7 1 .5 7 0 2 x 4 6 .
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A B C D Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor 8 7 6 P in A 1 5 5 4 4 3 3 2 2 DWG. NO. 79Z0000128 1 3 .1 REV S HEE T 3 O F 6 T IT L E : S o ck e t F (1 2 0 7 ) P ro c es so r C o m p o n e n t K e e p o u t a n d H e ig h t R e s t r ic ti o n s , f o r C u s to m 1 U / 2 P F o r m F a c t o r A D V A N C E D M IC R O D E V IC E S A U S T IN , T E X A S 1 A B C D 32800 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t . 0 .
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A B C Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor 8 7 2 0 . 0 0 [ 0 . 7 8 7 '' ] M a x c o m p o n e n t h e ig h t . . 3 . 3 0 [ 0 . 1 3 0 ' '] M a x c o m p o n e n t h e ig h t . 2 1 .0 0 0 .8 2 7 0 .0 0 0 .0 0 0 5 7 .7 4 2 .2 7 3 1.681 42.71 D 7 H e a t S in k H e ig h t R e s t r ic tio n Z o n e V ie w 8 1.26 6 2x 32.16 Appendix B 6 6 0.000 0.00 Figure 21.
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A B C 7 P in A 1 6 5 4 4 3 3 2 2 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor DW G. NO. 79Z0000128 1 3 .1 REV S HEE T 5 O F 6 T IT L E : S o ck e t F (1 2 0 7 ) P ro c e s so r C o m p o n e n t K e e p o u t a n d H e ig h t R e s t r ic ti o n s , f o r C u s to m 1 U / 2 P F o r m F a c t o r A D V A N C E D M IC R O D E V IC E S A U S T IN , T E X A S 1 A B C D 32800 8 N o t h r o u g h h o le c o m p o n e n t s . 1 4 .6 3 0 . 5 7 6 0 .
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A B C Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor 8 3 . 3 0 [ 0 . 1 3 0 ' '] M a x c o m p o n e n t h e i g h t . 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t . 7 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d . 5 1 .3 7 2 .0 2 2 1 8 .3 7 0 .7 2 3 2 x 3 9 .8 7 1 .5 7 0 2 x 1 0 .0 0 0 .
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Thermal Design Guide for Socket F (1207) Processors 52 32800 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Rev. 3.
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32800 Rev. 3.00 August 2006 Appendix C Thermal Design Guide for Socket F (1207) Processors Keep-Out Drawings for Custom 2U4P Systems Based on the Socket F (1207) Processor Appendix C contains detailed recommended keep out drawings for processor heat sink and mounting hardware for a 2U-4P system based on the socket F (1207) processor. Depending on the system features and layout, more space around the processor may be available for the thermal solution than is shown in these drawings.
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Figure 24. 54 A B C D 6 8 .5 8 8 5 0 .8 0 8 6 2 .0 0 4 3 .0 0 2 8 .0 0 8 .0 0 1 5 .2 4 7 7 P in A 1 1 3 .0 0 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 6 5 5 8 .8 0 5 .9 0 7 .6 2 3 .6 0 1 0 .0 0 4 4 2 C h a n g e d 2 U 4 S n o t a t io n t o 2 U / 4 P 3 .1 3 2 0 . 0 0 [ 0 . 7 8 7 ''] M a x c o m p o n e n t h e ig h t . 1 0 . 0 0 [ 0 . 3 9 4 ''] M a x c o m p o n e n t h e ig h t . 3 . 3 0 [ 0 .
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A B C 35.65 1.40 4 2x 32.1 6 1.266 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 8 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t . 7 0 . 0 0 [ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; N o o u t e r la y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 ''] M a x c o m p o n e n t h e ig h t ; T i e t o g r o u n d . 7 .0 3 0 .2 7 7 2 x 0 .0 0 0 .0 0 0 2 x 1 0 .7 5 0 .4 2 3 2 x 1 8 .3 7 0 .7 2 3 2 x 2 5 .9 9 1 .0 2 3 2 x 4 3 .7 7 1 .
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A B C D Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 8 7 6 P in A 1 5 5 4 4 3 3 2 2 DW G. NO. 79Z0000129 1 REV 3 .1 SHEET 3 OF 6 T IT L E : S o c k e t F (1 2 0 7 ) P ro c e s s o r C o m p o n e n t K e e p o u t a n d H e ig h t R e s tr ic tio n s , fo r C u s to m 2 U /4 P F o rm F a c to r A D V A N C E D M IC R O D E V IC E S A U S T IN , T E X A S 1 A B C D 32800 0 . 0 0 [ 0 . 0 0 0 ''] M a x c o m p o n e n t h e i g h t . 0 .
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A B C D 2x Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 8 7 2 0 . 0 0 [ 0 . 7 8 7 ''] M a x c o m p o n e n t h e i g h t . 1 0 . 0 0 [ 0 . 3 9 4 ''] M a x c o m p o n e n t h e i g h t . 3 . 3 0 [ 0 . 1 3 0 ''] M a x c o m p o n e n t h e ig h t. 1 5 .9 2 0 .6 2 7 0 .0 0 0 .0 0 0 5 2 .6 6 2 .0 7 3 6 5 .3 7 2 .5 7 4 H e a t S in k H e ig h t R e s t r ic t io n Z o n e V ie w 7 0.693 17.59 6 6 P in A 1 5 5 2.260 57.41 8 2x 32.1 6 1.266 2x 1.
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A B Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 7 6 P in A 1 5 4 4 3 3 2 2 DWG. NO. 79Z0000129 1 REV 3 .1 SHEET 5 OF 6 T IT L E : S o ck e t F (1 2 0 7 ) P ro ce s so r C o m p o ne n t K e e p o u t a n d H e i g h t R e s t r ic t i o n s , f o r C u s to m 2 U /4 P F o r m F a c to r A D V A N C E D M IC R O D E V IC E S A U S T IN , T E X A S 1 A B C D 32800 8 0 . 0 0 [ 0 .
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A B C D 40.59 1.598 35.04 1.38 0 2x Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 8 3 . 3 0 [ 0 . 1 3 0 '' ] M a x c o m p o n e n t h e ig h t . 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t . 7 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t ; N o o u t e r l a y e r t r a c e s . 0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d . 4 9 .3 7 1 .9 4 4 3 9 .8 7 1 .5 7 0 2 x 1 0 .0 0 0 .3 9 4 1 8 .
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Thermal Design Guide for Socket F (1207) Processors 60 32800 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Rev. 3.
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32800 Rev. 3.02 August 2006 Appendix D Thermal Design Guide for Socket F (1207) Processors Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D describes the flow simulation results for 2U-4P systems based on socket F (1207) processors. Figure 30 shows a floor plan of an AMD reference custom 2U-4P system. Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System Figure 31 shows a streamline plot of an AMD reference 2U-4P system.
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Thermal Design Guide for Socket F (1207) Processors Figure 31. 32800 Rev. 3.00 August 2006 Streamline Plot of AMD Reference Custom 2U-4P System Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan described in Chapter 5 on page 29 predicts a flow rate through the heat sink of approximately 18 CFM and an air inlet temperature at the processor heat sinks of 3°C above external ambient temperature.