Specification Sheet

PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
22AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile K
Heat S ink Class
HS55
Heat S ink Thermal
Re si stance
0.45°C/W
Heat S ink Local
Ambi ent
42°C
Profile Thermal
Re si stance
0.369°C/W
Profile Ambient
48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.4°C
25.0 W 57.2°C
30.0 W 59.1°C
35.0 W 60.9°C
40.0 W 62.8°C
45.0 W 64.6°C
50.0 W 66.5°C
55.0 W 68.3°C
60.0 W 70.1°C
65.0 W 72.0°C
Thermal Profile P
Heat S ink Class
HS65
Heat S ink Thermal
Re si stance
0.35°C/W
Heat S ink Local
Ambi ent
42°C
Profile Thermal
Re si stance
0.275°C/W
Profile Ambient
48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 56.3°C
35.0 W 57.6°C
40.0 W 59.0°C
45.0 W 60.4°C
50.0 W 61.8°C
55.0 W 63.1°C
60.0 W 64.5°C
65.0 W 65.9°C
70.0 W 67.3°C
75.0 W 68.6°C
80.0 W 70.0°C