Datasheet

Dubox™ Low Profile Vertical Receptacles
2.54 mm
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
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■ The Dubox™ contact has a pre-
stressed, dual beam design to
enable low insertion force
■ Selective plating
■ Floating solder tails self-center on
circuit pads and assure coplanarity
Technical Data
Physical
Housing: High-temperature,
grey thermoplastic
Flammability rating: UL 94 V-0
Contact: Phosphor-bronze
Plating: Gold or tin-lead over 1.27 µm nickel
Electrical Performance
Current rating:
3 A dc max. per individual contact
2 A dc max. per contact for fully
energized connector
Insulation resistance: 1x 10
5
MΩ min.
Contact resistance: 15 mΩ max. initial,
20 mΩ max. after environmental tests
Dielectric withstanding voltage: 1000 V rms
Mechanical Performance
Mating cycles (durability): 200
Insertion force per gold contact:
1.50 N (150 gf) avg.
Withdrawal force per gold contact:
0.30 N (30 gf) min.
Operating Temperature Range
-65°C to +125°C
Packaging
Tubes,Tape on Reel or plastic boxes
Reference Information
File no. E66906
File no. LR46923
Product drawing: By 5-digit base part number
Product specification: BUS-12-055
Tape and Reel packaging data : TA-856
Specifications subject to change without notice.
Mating Data
■
BergStik® Unshrouded straight headers
■
BergStik® Unshrouded right angle headers
■
BergStik® Unshrouded stacking headers
Insertion Depth
■
Top Entry: 3.86 mm min. to 6.10 mm max.
[provides .381 mm wipe]
■
Bottom Entry: 5.08 mm min.
[provides .381 mm wipe] plus board thickness
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Recommended IR profile: TA-842
Typical Applications
Receptacle
Height
Insertion
Depth
Low profile 7.0 mm
for closer board stacking
optional hold down