Datasheet

AD5764R Data Sheet
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter Rating
AV
DD
to AGND, DGND
−0.3 V to +17 V
AV
SS
to AGND, DGND +0.3 V to −17 V
DV
CC
to DGND −0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to (DV
CC
+ 0.3 V) or +7 V,
whichever is less
Digital Outputs to DGND −0.3 V to DV
CC
+ 0.3 V
REFAB, REFCD to AGND, PGND −0.3 V to AV
DD
+ 0.3 V
REFOUT to AGND AV
SS
to AV
DD
TEMP AV
SS
to AV
DD
VOUTx to AGND AV
SS
to AV
DD
AGND to DGND −0.3 V to +0.3 V
Operating Temperature Range
Industrial −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
max) 150°C
Lead Temperature (Soldering) JEDEC industry standard
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
32-Lead TQFP 65 12 °C/W
ESD CAUTION