Datasheet

AD604
Rev. G | Page 29 of 32
COMPLIANT TO JEDEC STANDARDS MO-150-AG
060106-A
24
13
12
1
8.50
8.20
7.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
Figure 66. 24-Lead Shrink Small Outline Package [SSOP]
(RS-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD604ANZ −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1
AD604AR −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604AR-REEL −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARZ −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARZ-RL −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARS −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARS-REEL7 −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARSZ −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARSZ-RL −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARSZ-R7 −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.