Datasheet

AD7776/AD7777/AD7778
–4–
REV. A
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
CC
to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
AGND, RTN to DGND . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
CS, RD, WR, CLKIN, DB0–DB9,
BUSY/INT to DGND . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
Analog Input Voltage to AGND . . . . . . . –0.3 V, V
CC
+ 0.3 V
REFOUT to AGND . . . . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
REFIN to AGND . . . . . . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
Operating Temperature Range
All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . .+260°C
SOIC Packages, Power Dissipation . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ORDERING GUIDE
Temperature No. of Package
Model Range Channels Option*
AD7776AR –40°C to +85°C1 RW-24
AD7777AN –40°C to +85°C4 N-28
AD7777AR –40°C to +85°C4 RW-28
AD7778AS –40°C to +85°C8 S-44
*R = SOIC, N = PDIP, S = PQFP
PQFP Package, Power Dissipation . . . . . . . . . . . . . . 500 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
*Stresses above those listed under absolute maximum ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
PIN CONFIGURATIONS
44-Lead PQFP
7
8
9
10
11
6
5
4
3
2
1 33
32
31
30
29
28
27
26
25
24
23
18 19 20 21 221716151413
12
39 38 37 36 35 3444 43 42 41 40
TOP VIEW
(Not to Scale)
AD7778
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
C
REFIN
RTN
AGND
REFIN
A
IN
8
A
IN
7
A
IN
6
A
IN
5
A
IN
4
A
IN
3
A
IN
2
A
IN
1
AGND
REFOUT
V
CC
DB8
(MSB) DB9
CLKIN
BUSY/INT
RD
WR
CS
NC = NO CONNECT
24-Lead SOIC
1
2
24
23
22
10
15
11
12
14
13
21
20
18
17
16
19
9
3
4
5
TOP VIEW
(Not to Scale)
7
8
6
AD7776
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
C
REFIN
AGND
RTN
REFIN
A
IN
AGND
REFOUT
V
CC
DB8
(MSB) DB9
CLKIN
BUSY/INT
RD
WR
CS
28-Lead PDIP and SOIC
1
2
24
23
22
10
15
11
12
14
13
21
20
17
16
9
3
4
5
7
8
6
18
19
TOP VIEW
(Not to Scale)
28
27
26
25
AD7777
NC
NC = NO CONNECT
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
DB8
(MSB) DB9
BUSY/INT
C
REFIN
AGND
RTN
REFIN
AGND
REFOUT
V
CC
CLKIN
RD
WR
CS
A
IN
4
A
IN
3
A
IN
2
A
IN
1
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7776/AD7777/AD7778 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.