Datasheet

AD8016 Data Sheet
Rev. C | Page 20 of 20
OUTLINE DIMENSIONS
Figure 50. 24-Lead Batwing SOIC, Thermally Enhanced w/Fused Leads [SOIC_W_BAT]
(RB-24)
Dimensions shown in millimeters
Figure 51. 28-Lead Thin Shrink Small Outline With Exposed Pad [TSSOP_EP]
(RE-28-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8016ARBZ −40°C to +85°C 24-Lead SOIC_W_BAT RB-24
AD8016ARBZ-REEL −40°C to +85°C 24-Lead SOIC_W_BAT RB-24
AD8016AREZ −40°C to +85°C 28-Lead TSSOP_EP RE-28-1
AD8016AREZ-REEL −40°C to +85°C 28-Lead TSSOP_EP RE-28-1
AD8016AREZ-REEL7 −40°C to +85°C 28-Lead TSSOP_EP RE-28-1
1
Z = RoHS Compliant Part.
0.32
0.23
1.27
0.40
8°
0°
0.75
0.25
 45°
24 13
12
1
15.60
15.20
7.60
7.40
PIN 1
10.65
10.00
SEATING
PLANE
0.30
0.10
0.51
0.33
2.65
2.35
1.27
BSC
COMPLIANT WITH JEDEC STANDARDS MS-013-AD
COMPLIANT TO JEDEC STANDARDS MO-153-AET
28
15
14
1
EXPOSED
PAD
(Pins Up)
9.80
9.70
9.60
4.50
4.40
4.30
6.40
BSC
TOP VIEW
BOTTOM VIEW
0.65 BSC
0.15
0.05
COPLANARITY
0.10
1.20 MAX
1.05
1.00
0.80
0.30
0.19
SEATING
PLANE
0.20
0.09
3.05
3.00
2.95
8°
0°
0.75
0.60
0.45
3.55
3.50
3.45
02-23-2012-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01019-0-3/12(C)