Datasheet

AD8120 Data Sheet
Rev. A | Page 16 of 16
OUTLINE DIMENSIONS
3.65
3.50 SQ
3.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
32
9
8
1
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
04-13-2012-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
AD8120ACPZ-R2 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD8120ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD8120ACPZ-RL −40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
1
Z = RoHS Compliant Part.
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D07839-0-5/12(A)