Datasheet

AD8156
Rev. 0 | Page 19 of 20
OUTLINE DIMENSIONS
BALL DIAMETER
745
63
2
1
6.00
BSC SQ
A1 CORNER
INDEX AREA
A
B
C
D
E
F
G
BOTTOM
VIEW
SEATING
PLANE
DETAILA
0.70
0.60
0.50
COPLANARITY
0.20
*
1.31
1.21
1.10
*
1.85
1.71
1.50
TOP VIEW
1.00
BSC
BALL A1
PAD CORNER
DETAIL A
0.25
MIN
8.20
8.00 SQ
7.80
*
COMPLIANT WITH JEDEC STANDARDS MO-192-ABB-1
WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
012006-0
Figure 26. 49-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-49-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8156ABCZ
1
−40°C to +85°C 49-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-49-3
AD8156-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.