Datasheet

AD9102 Data Sheet
Rev. 0 | Page 8 of 36
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter Rating
AVDD1, AVDD2, DVDD to AGND, DGND,
CLKGND
−0.3 V to +3.9 V
CLKVDD to AGND, DGND, CLKGND −0.3 V to +3.9 V
CLDO, DLDO1, DLDO2 to AGND, DGND,
CLKGND
−0.3 V to 2.2 V
AGND to DGND, CLKGND −0.3 V to +0.3 V
DGND to AGND, CLKGND −0.3 V to +0.3 V
CLKGND to AGND, DGND
−0.3 V to +0.3 V
CS, SDIO, SCLK, SDO/
SDI2/DOUT,
RESET, TRIGGER to
DGND
−0.3 V to DVDD + 0.3 V
CLKP, CLKN to CLKGND −0.3 V to CLKVDD + 0.3 V
REFIO to AGND −1.0 V to AVDD + 0.3 V
IOUTP, IOUTN to AGND −0.3 V to DVDD + 0.3 V
FSADJ, CAL_SENSE to AGND −0.3 V to AVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a standard circuit board for surface-mount
packages. θ
JC
is measured from the solder side (bottom) of the
package.
Table 10. Thermal Resistance
Package Type θ
JA
θ
JB
θ
JC
Unit
32-Lead LFCSP with Exposed
Paddle
30.18 6.59 3.84 °C/W
ESD CAUTION