Datasheet

AD9212 Data Sheet
Rev. E | Page 56 of 56
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.22 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.55
7.50 SQ
7.45
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-23-2010-B
EXPOSED PAD
(BOTTOM VIEW)
Figure 85. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Notes
Temperature
Range
Package Description
Package
Option
AD9212ABCPZ-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9212ABCPZRL7-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7” Tape and Reel CP-64-6
AD9212ABCPZ-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9212ABCPZRL7-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7” Tape and Reel CP-64-6
AD9212-65EBZ
2
Evaluation Board
1
Z = RoHS Compliant Part.
2
Interposer board (HSC-ADC-FIFO5-INTZ) is required to connect to HSC-ADC-EVALCZ data capture board.
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D05968-0-12/11(E)