Datasheet

Data Sheet AD9222
Rev. F | Page 59 of 60
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.22 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.55
7.50 SQ
7.45
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-23-2010-B
EXPOSED PAD
(BOTTOM VIEW)
Figure 101. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
AD9222ABCPZ-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
AD9222ABCPZ-50 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-50 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
AD9222ABCPZ-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
AD9222-65EBZ
Evaluation Board
1
Z = RoHS Compliant Part.
2
The interposer board (HSC-ADC-FIFO5-INTZ) is required to connect to the HSC-ADC-EVALCZ data capture board.