Datasheet

AD9230-11
Rev. 0 | Page 25 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
100808-A
PIN 1
INDICATOR
TOP
VIEW
7.75
BSC SQ
8.00
BSC SQ
1
56
14
15
43
42
28
29
4.45
4.30 SQ
4.15
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0
.85
0
.80
6.50
REF
SEATING
PLANE
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
0.05 MAX
0.02 NOM
0.30 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9230BCPZ11-200
1
−40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-2
AD923011-200EBZ
1
LVDS Evaluation Board
1
Z = RoHS Compliant Part.