Datasheet

Data Sheet AD9278
Rev. A | Page 43 of 44
OUTLINE DIMENSIONS
*
COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1
WITH EXCEPTION TO PACKAGE HEIGHT.
06-26-2012-B
0.80
0.60
REF
A
B
C
D
E
F
G
910 81112 7 564231
BOTTOM VIEW
8.80
BSC SQ
H
J
K
L
M
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.12
0.50
0.45
0.40
*
1.40 MAX
BALL DIAMETER
SEATING
PLANE
10.10
10.00 SQ
9.90
A1 BALL
CORNER
A1 BALL
CORNER
0.25 MIN
0.65 MIN
Figure 67. 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-144-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range Package Description
Package
Option
AD9278BBCZ −40°C to +85°C 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA] BC-144-1
AD9278-50EBZ Evaluation Board
1
Z = RoHS Compliant Part.