Datasheet

AD9516-3 Data Sheet
Rev. C | Page 16 of 80
ABSOLUTE MAXIMUM RATINGS
Table 18.
Parameter Rating
VS, VS_LVPECL to GND −0.3 V to +3.6 V
VCP to GND −0.3 V to+5.8 V
REFIN,
REFIN
to GND −0.3 V to V
S
+ 0.3 V
REFIN to
REFIN
−3.3 V to +3.3 V
RSET to GND −0.3 V to V
S
+ 0.3 V
CPRSET to GND −0.3 V to V
S
+ 0.3 V
CLK,
CLK
to GND
−0.3 V to V
S
+ 0.3 V
CLK to
CLK
−1.2 V to +1.2 V
SCLK, SDIO, SDO,
CS
to GND −0.3 V to V
S
+ 0.3 V
OUT0,
OUT0
, OUT1,
OUT1
, OUT2,
OUT2
,
OUT3,
OUT3
, OUT4,
OUT4
, OUT5,
OUT5
,
OUT6,
OUT6
, OUT7,
OUT7
, OUT8,
OUT8
,
OUT9,
OUT9
to GND
−0.3 V to V
S
+ 0.3 V
SYNC
to GND
−0.3 V to V
S
+ 0.3 V
REFMON, STATUS, LD to GND −0.3 V to V
S
+ 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature (10 sec)
300°C
1
See Table 19 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 19.
Package Type
1
θ
JA
Unit
64-Lead LFCSP 22 °C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-2.
ESD CAUTION