Datasheet

AD9524 Data Sheet
Rev. D | Page 12 of 56
ABSOLUTE MAXIMUM RATINGS
Table 17.
Parameter Rating
VDD3_PLL1, VDD3_PLL2, VDD3_REF,
VDD3_OUT, LDO_VCO to GND
−0.3 V to +3.6 V
REFA,
REFA
,
REFIN
, REFB,
REFB
to GND
−0.3 V to +3.6 V
SCLK/SCL, SDIO/SDA, SDO,
CS
to GND −0.3 V to +3.6 V
OUT0,
OUT0
, OUT1,
OUT1
, OUT2,
OUT2
,
OUT3,
OUT3
, OUT4,
OUT4
, OUT5,
OUT5
,
to GND
−0.3 V to +3.6 V
SYNC
,
RESET
,
PD
to GND −0.3 V to +3.6 V
STATUS0, STATUS1 to GND −0.3 V to +3.6 V
SP0, SP1, EEPROM_SEL to GND −0.3 V to +3.6 V
VDD1.8_OUT, LDO_PLL1, LDO_PLL2 to
GND
2 V
Storage Temperature Range
−65°C to +150°C
Lead Temperature (10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions
above those indicated in the operational section of this specification
is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 18. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec) θ
JA
1, 2
θ
JC
1, 3
θ
JB
1, 4
Ψ
JT
1, 2
Unit
48-Lead LFCSP,
7 mm ×
7 mm
0
26.1
1.7
13.8
0.2
°C/W
1.0 22.8 0.2 °C/W
2.5 20.4 0.3 °C/W
1
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
For information about power dissipation, refer to the Power
Dissipation and Thermal Considerations section.
ESD CAUTION