Datasheet

AD9524 Data Sheet
Rev. D | Page 38 of 56
The second step is to multiply the power dissipated by the
thermal impedance to determine the maximum power
gradient. For this example, a thermal impedance of θ
JA
=
20.1
°C/W was used.
Example 1
(703 mW × 20.1°C/W) = 14.1°C
With an ambient temperature of 85°C, the junction temperature is
T
J
= 85°C + 14.1°C = 99°C
This junction temperature is below the maximum allowable.
Example 2
(1223 mW × 20.1°C/W) = 24.6°C
With an ambient temperature of 85°C, the junction temperature is
T
J
= 85°C + 24.6°C = 109°C
This junction temperature is below the maximum allowable.
THERMALLY ENHANCED PACKAGE MOUNTING
GUIDELINES
Refer to the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP), for more information about mounting devices with
an exposed paddle.