Datasheet

Data Sheet AD9633
Rev. 0 | Page 11 of 40
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0 V
Digital Outputs (D0±x, D1±x, DCO+,
DCO−, FCO+, FCO−) to AGND
−0.3 V to +2.0 V
CLK+, CLK− to AGND −0.3 V to +2.0 V
VIN+x, VIN−x to AGND −0.3 V to +2.0 V
SCLK/DTP, SDIO/OLM, CSB to AGND −0.3 V to +2.0 V
SYNC, PDWN to AGND −0.3 V to +2.0 V
RBIAS to AGND −0.3 V to +2.0 V
VREF, SENSE to AGND −0.3 V to +2.0 V
Environmental
Operating Temperature Range (Ambient) −40°C to +85°C
Maximum Junction Temperature 150°C
Lead Temperature (Soldering, 10 sec) 300°C
Storage Temperature Range (Ambient) −65°C to +150°C
Table 7. Thermal Resistance
Package Type
Air Flow
Velocity
(m/sec)
θ
JA
1
θ
JB
θ
JC
Unit
48-Lead LFCSP 0.0 23.7 7.8 7.1 °C/W
7 mm × 7 mm 1.0 20.0 N/A N/A °C/W
CP-48-13 2.5 18.7 N/A N/A °C/W
1
θ
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.