Datasheet

AD9640
Rev. B | Page 14 of 52
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 9.
Parameter Rating
ELECTRICAL
AVDD, DVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +3.9 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −3.9 V to +2.0 V
VIN+A/VIN+B, VIN−A/VIN−B to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to +3.9 V
SYNC to AGND −0.3 V to +3.9 V
VREF to AGND −0.3 V to AVDD + 0.2 V
SENSE to AGND −0.3 V to AVDD + 0.2 V
CML to AGND −0.3 V to AVDD + 0.2 V
RBIAS to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to +3.9 V
SCLK/DFS to DRGND −0.3 V to +3.9 V
SDIO/DCS to DRGND −0.3 V to DRVDD + 0.3 V
SMI SDO/OEB −0.3 V to DRVDD + 0.3 V
SMI SCLK/PDWN −0.3 V to DRVDD + 0.3 V
SMI SDFS −0.3 V to DRVDD + 0.3 V
D0A/D0B through D13A/D13B to
DRGND
−0.3 V to DRVDD + 0.3 V
FD0A/FD0B through FD3A/FD3B to
DRGND
−0.3 V to DRVDD + 0.3 V
DCOA/DCOB to DRGND −0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +150°C
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 10. Thermal Resistance
Package
Type
Airflow
Velocity
(m/s)
θ
JA
1, 2
θ
JC
1, 3
θ
JB
1, 4
Unit
64-lead LFCSP
9 mm × 9 mm
0 18.8 0.6 6.0 °C/W
1.0 16.5 °C/W
2.0 15.8 °C/W
1
JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Typical θ
JA
is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow improves heat dissipation, which
reduces θ
JA
. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θ
JA
.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.