Datasheet

AD9709
Rev. B | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
THERMAL RESISTANCE
Parameter
With
Respect To
Rating
AVDD ACOM −0.3 V to +6.5 V
DVDD1, DVDD2 DCOM1/DCOM2 −0.3 V to +6.5 V
ACOM DCOM1/DCOM2 −0.3 V to +0.3 V
AVDD DVDD1/DVDD2 −6.5 V to +6.5 V
MODE, CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
DCOM1/DCOM2
−0.3 V to DVDD1/
DVDD2 + 0.3 V
Digital Inputs DCOM1/DCOM2
−0.3 V to DVDD1/
DVDD2 + 0.3 V
I
OUTA1
/I
OUTA2
,
I
OUTB1
/I
OUTB2
ACOM −1.0 V to AVDD + 0.3 V
REFIO, FSADJ1,
FSADJ2
ACOM −0.3 V to AVDD + 0.3 V
GAINCTRL, SLEEP ACOM −0.3 V to AVDD + 0.3 V
Junction Temperature 150°C
Storage Temperature
Range
−65°C to +150°C
Lead Temperature
(10 sec)
300°C
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
Unit
48-Lead LQFP 91 °C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.